Substrate Edge Nozzle Layout for Precise Etching Width Control
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Solution Overview
Problem
Existing substrate processing apparatuses lack a mechanism for accurately adjusting the etching width at the peripheral edge of substrates, which is crucial for precision and environmental efficiency, particularly in compact and stacked processing systems.
Innovation Solution
A substrate processing apparatus with a rotating mechanism and a nozzle system that includes a nozzle body, support, and position adjuster, allowing the nozzle body to move relative to the support within a virtual arc centered on the substrate's vertical axis, enabling precise adjustment of the etching width and preventing liquid dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the nozzle structure is made compact to reduce footprint and gas usage, then environmental efficiency is improved, but the ability to accurately adjust etching width is worsened
Solution Approach 1:
The nozzle is designed with a movable structure that can dynamically adjust its position in the radial direction relative to the substrate. The position adjuster mechanism enables the nozzle to move along the virtual arc while maintaining a compact overall structure, resolving the contradiction between compactness and adjustability
Solution Approach 2:
Instead of adjusting the nozzle position in a straight radial direction, the mechanism moves the nozzle along a virtual arc centered on the substrate's vertical axis. This arc-shaped movement path allows precise etching width control while keeping the adjustment mechanism compact and integrated within the processing chamber
2Manufacturing precision
If the nozzle position adjustment mechanism is added to achieve high accuracy etching width control, then manufacturing precision is improved, but device complexity is worsened
Solution Approach 1:
The position adjuster mechanism serves multiple functions: it adjusts the nozzle position in the radial direction, maintains the nozzle's alignment along the virtual arc, and integrates compactly within the processing chamber. This multi-functionality reduces the need for separate adjustment mechanisms, thereby limiting the increase in device complexity
Solution Approach 2:
The position adjuster mechanism is integrated within the processing chamber's internal space, with the nozzle nested within the support structure. The compact arrangement of components minimizes the additional space required for the adjustment mechanism, reducing the impact on device complexity
3Volume of stationary object
If the nozzle is positioned closer to the substrate periphery to reduce chamber size, then chamber volume is reduced, but the range of etching width adjustment is worsened
Solution Approach 1:
The nozzle is designed with a movable structure that can dynamically adjust its position in the radial direction relative to the substrate. The position adjuster mechanism enables the nozzle to move along the virtual arc while maintaining a compact overall structure, resolving the contradiction between compactness and adjustability
Solution Approach 2:
Instead of adjusting the nozzle position in a straight radial direction, the mechanism moves the nozzle along a virtual arc centered on the substrate's vertical axis. This arc-shaped movement path allows precise etching width control while keeping the adjustment mechanism compact and integrated within the processing chamber
Data Source
AI summary
In a substrate processing apparatus, a rotating mechanism holds a circular substrate in a horizontal posture and rotates the substrate about a vertical axis passing through a center of the substrate. A nozzle mechanism includes a nozzle body, a support and a position adjuster. The nozzle body is arranged below the substrate and having a discharge port from which a processing liquid is discharged toward a lower surface peripheral edge part of the substrate. The support supports the nozzle body in a manner that makes the position of the discharge port changeable in a radial direction of the substrate. The position adjuster adjusts the position of the discharge port by moving the nozzle body relative to the support. Thee support and the position adjuster are arranged internal to a virtual arc centered on the vertical axis and passing through the discharge port.