Substrate Edge Partial Grinding to Reduce Side Cracks

The patent applies local quality by selectively processing only the protruding side portions of substrates that extend beyond the display area, while leaving the main substrate body unprocessed. This localized grinding approach addresses structural weaknesses at critical edges without adding unnecessary complexity to the entire manufacturing process.

The grinding process is performed as a preliminary action after substrate cutting but before final assembly. This timing allows defects and cracks to be addressed early in the manufacturing sequence, preventing potential failures during subsequent handling and assembly operations.

Instead of uniformly grinding all substrate surfaces, the patent applies grinding only to specific protruding side portions that extend beyond the display area. This selective approach enhances structural strength where needed while avoiding unnecessary processing of areas that do not require reinforcement.

The patent implements partial action by grinding only the necessary protruding portions of substrates rather than performing complete surface treatment. This partial processing achieves the required structural reinforcement while reducing manufacturing complexity and cost compared to full substrate grinding.

The patent applies local quality by selectively reinforcing the side portions of substrates through grinding, creating a harder, more wear-resistant surface at the edges. This localized treatment prepares the substrate edges for reliable contact and collision resistance in tiled configurations without affecting the overall display area.

The grinding process is performed as a preliminary action before substrate tiling and assembly. This advance processing strengthens the substrate edges in anticipation of future contact and collision stresses that will occur during tiled device operation, thereby improving long-term reliability.