Roll-Type Substrate Edge Cleaning for Faster Particle Removal
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Solution Overview
Problem
Existing substrate cleaning apparatuses lack sufficient cleaning performance, particularly in removing particles from edge portions, and face challenges in efficiently cleaning substrates within limited time due to restrictions on cleaning processes and substrate types.
Innovation Solution
A substrate cleaning apparatus featuring roll-type cleaning members with large and small diameter portions that rotate in parallel to the substrate, allowing for effective cleaning of both surfaces while avoiding contact with each other, combined with a substrate support mechanism and liquid supply nozzles to enhance cleaning efficiency and particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning apparatuses are used, then the cleaning process is simple, but the cleaning performance is insufficient especially for edge portions
Solution Approach 1:
The cleaning member is divided into multiple cleaning units arranged in the width direction, with each unit having independent cleaning elements that can be adjusted separately. This segmentation allows targeted cleaning of different substrate regions including edge portions, improving overall cleaning performance while maintaining manageable system complexity
Solution Approach 2:
The cleaning apparatus employs cleaning elements with locally optimized properties - different cleaning forces, sizes, and positions are applied to different width positions of the substrate. Edge portions receive specialized cleaning attention through specifically positioned cleaning elements, while central regions receive appropriate cleaning intensity, achieving high cleaning performance across all areas
2Manufacturing precision
If cleaning time is extended to improve cleaning performance, then particle removal is enhanced, but throughput is reduced
Solution Approach 1:
Multiple cleaning units operate simultaneously and continuously across the substrate width, maintaining constant cleaning action without interruption. The independent adjustment capability allows each cleaning unit to work at optimal parameters continuously, achieving high particle removal efficiency while completing the process in limited time to maintain throughput
Solution Approach 2:
The cleaning apparatus applies enhanced cleaning action specifically where needed - edge portions and areas with higher particle contamination receive intensified cleaning through independently adjustable cleaning elements. This partial excessive action concentrates cleaning effort on critical areas, achieving high particle removal without requiring extended cleaning time across the entire substrate
3Manufacturing precision
If cleaning members are positioned to contact substrate edges, then edge cleaning is improved, but dust generation increases
Solution Approach 1:
The cleaning elements are designed with dynamic adjustment capabilities, allowing their position, pressure, and contact force to be optimized in real-time. This dynamic control enables effective edge cleaning while adjusting parameters to minimize dust generation, adapting the cleaning action to the specific conditions at different substrate locations
Solution Approach 2:
The cleaning apparatus utilizes independently adjustable parameters for each cleaning unit - including cleaning force, element size, and position - to optimize the cleaning process. By changing these parameters specifically for edge portions, the system achieves improved edge cleaning performance while controlling dust generation through parameter optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved cleaning performance by repeatedly contacting corner portions of the substrate with roll-type cleaning members, reducing dust generation and enhancing particle removal, while the liquid supply ensures effective cleaning and discharge, addressing the limitations of existing technologies.
Implementation Method 1
a roll-type first cleaning member (2a) configured to clean a first surface of the substrate by rotating while being in contact with a bevel and/or an edge of the first surface of the substrate
Implementation Method 2
a first nozzle configured to supply liquid to the first surface of the substrate in a direction toward an edge of the substrate
Data Source
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AI summary
Provided is a substrate cleaning apparatus including: a substrate support mechanism configured to support a substrate (W); and a roll-type first cleaning member (2a) configured to clean a first surface of the substrate (W) by rotating while being in contact with a bevel and/or an edge of the first surface of the substrate (W), wherein a rotation axis of the first cleaning member (2a) is in parallel with the substrate (W), and the first cleaning member (2a) has a large diameter portion (21a) and a small diameter portion (22a).