Substrate Edge Plasma Inspection for Defect Detection and Maintenance
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Solution Overview
Problem
The existing substrate treating methods using plasma in semiconductor manufacturing are inefficient in determining defective substrates and require manual inspection, leading to increased time and subjectivity, and result in damage to dielectric components due to foreign substances accumulation, which complicates maintenance and affects film removal processes.
Innovation Solution
A substrate treating method that involves imaging the edge region of the substrate post-treatment, comparing the images with a database of defective images to determine defects, and performing maintenance on dielectric components based on the analysis, including calculating the replacement time for components like dielectric plates to prevent damage and ensure optimal operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection is used to determine substrate defects, then operator flexibility is maintained, but inspection time increases and objectivity is compromised
Solution Approach 1:
The patent replaces manual visual inspection with an automated imaging system that captures substrate images and compares them against stored reference images. This substitution of mechanical/manual inspection with an automated optical system eliminates subjectivity while maintaining rapid assessment capability, directly resolving the contradiction between objectivity and inspection time.
Solution Approach 2:
The system creates digital copies (images) of substrates and compares them against stored reference images in a database. This copying approach allows multiple substrates to be assessed rapidly against standardized criteria, improving both objectivity through consistent comparison and speed through automated image processing.
2Productivity
If plasma treatment is performed continuously, then productivity is maintained, but dielectric components accumulate foreign substances and become damaged
Solution Approach 1:
The system performs preliminary imaging and comparison of substrates before they complete the full treatment cycle. By detecting defects early through image comparison against reference images, the system can identify when dielectric components are accumulating foreign substances or becoming damaged, allowing maintenance to be scheduled before component failure occurs, thus maintaining both productivity and reliability.
Solution Approach 2:
The imaging and comparison system provides continuous feedback on substrate treatment quality and component condition. This feedback mechanism allows the system to monitor the accumulation of foreign substances on dielectric components in real-time, enabling proactive maintenance scheduling that prevents component damage while maintaining continuous operation.
3Reliability
If dielectric components are replaced frequently, then component damage is prevented, but maintenance time and cost increase
Solution Approach 1:
The system performs preliminary detection of component degradation through substrate imaging and comparison. By identifying the precise moment when dielectric components begin to accumulate harmful foreign substances or show signs of damage, the system enables maintenance to be scheduled at the optimal time - just before failure occurs - avoiding both premature replacement and catastrophic failure.
Solution Approach 2:
The system monitors changes in substrate treatment outcomes as indicators of component degradation. By tracking parameters such as treatment uniformity, film removal quality, and defect patterns through image comparison, the system detects when dielectric components are approaching failure thresholds, enabling maintenance to be scheduled based on actual condition rather than fixed intervals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and objective determination of substrate defects and optimal replacement timing for components, reducing maintenance needs and ensuring consistent film removal processes, thereby improving the yield and reliability of substrate treatment.
Implementation Method 1
A plasma refers to an ionized gas state composed of ions, radicals, and electrons, and is produced by very high temperatures, strong electric fields, or high-frequency electromagnetic fields. The ashing process or the etching process is performed by colliding or reacting with the film on the substrate by ion and radical particles contained in the plasma.
Data Source
AI summary
The inventive concept provides a substrate treating method. The substrate treating method includes treating an edge region of a substrate using a plasma; and acquiring an image to be determined by imaging a substrate on which a treatment has been completed in the treating the edge region, comparing the image to be determined with an image stored in a database, and determining whether a substrate treated in the treating the edge region is defective or not, and wherein the image stored in the database is a defective image of a substrate which has been determined as defective, which is previously stored in the database in the acquiring the image to be determined.