Substrate Edge Processing with Inclination-Based Position Correction
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately processing the peripheral regions of substrates due to the complexity of positioning the spin chuck, which is exacerbated by variations in rotation speed, leading to complications in configuration and operation.
Innovation Solution
A peripheral processing apparatus and method that utilizes a rotation holder, information detector, and position corrector to maintain a constant distance between the processing area and the substrate center by detecting substrate inclination and correcting the holding position based on detected information, allowing for processing with directivity and simplicity of configuration and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the spin chuck reciprocates in one direction and the opposite direction by an operation of the alignment mechanism, then the position of the peripheral portion of the substrate is compensated, but the configuration and operation become complicated
Solution Approach 1:
The invention extracts and eliminates the complex alignment mechanism from the system. Instead of using a spin chuck with reciprocating alignment mechanisms, the patent uses a simple rotation holder that rotates the substrate about a rotation axis, removing the need for complicated positioning mechanisms while maintaining processing accuracy through a different approach.
Solution Approach 2:
Instead of compensating for position changes by actively moving the spin chuck back and forth, the invention inverts the approach by maintaining a constant distance between the processing target and substrate center through rotational motion alone. The peripheral region processor is positioned to process at a constant radial distance, eliminating the need for active position compensation mechanisms.
2Manufacturing precision
If the spin chuck follows the change of the position of the peripheral portion of the substrate, then positioning accuracy is improved, but the operation becomes difficult depending on rotation speed
Solution Approach 1:
The invention inverts the tracking approach by not attempting to follow the changing position of the peripheral portion through active adjustment. Instead, it maintains a constant radial distance from the substrate center for processing, which naturally accommodates all rotation speeds without requiring speed-dependent operational adjustments.
Solution Approach 2:
The system allows the substrate rotation itself to define the processing geometry. By positioning the peripheral region processor to work at a constant distance from the center, the system automatically adapts to any rotation speed without requiring operator intervention or complex control mechanisms to maintain tracking accuracy.
3Manufacturing precision
If the distance between the peripheral portion and center changes during rotation, then processing of the entire circumference becomes inaccurate, but maintaining constant distance requires complex positioning
Solution Approach 1:
The invention inverts the problem-solving approach by not attempting to actively maintain constant distance through complex positioning mechanisms. Instead, it designs the system so that the peripheral region processor naturally operates at a constant radial distance from the substrate center through its geometric arrangement, allowing accurate processing of the entire circumference without complex active control.
Solution Approach 2:
The system uses dynamic rotation of the substrate about a fixed axis to achieve what static positioning mechanisms would require. By allowing the substrate to rotate freely while the peripheral region processor remains positioned at a constant radial distance, the system dynamically maintains constant processing distance without requiring complex active positioning control mechanisms.
Data Source
AI summary
Inclination identifying information for identifying inclination of a substrate with respect to a reference plane is detected. Based on the detected inclination identifying information and a first angle, a holding position of the substrate held by a rotation holder is corrected in a direction that is in parallel to the reference plane such that a distance between a portion of the substrate that is to be processed by a peripheral region processor and the center of the substrate is maintained constant. In this state, processing having directivity of inclination with respect to the reference plane by the first angle is performed on a peripheral region of the substrate by the peripheral region processor while the substrate is rotated by the rotation holder.


