Substrate Edge Film Removal Using Two-Stage Pulse Laser Irradiation
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Solution Overview
Problem
Conventional edge bead removing processes for substrates, such as semiconductor wafers, using chemical spraying are inefficient, leading to improper film removal, reduced production yield, and potential contamination due to pin marks on the substrate surface.
Innovation Solution
A method involving the irradiation of a plurality of unit pulse laser beams onto the edge region of a substrate, with a first irradiation operation followed by a second operation, to efficiently remove films while minimizing heat accumulation and deformation outside the edge region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical spraying is used for edge bead removing process, then the process is simple to implement, but the film removal is improper and production yield is reduced
Solution Approach 1:
The patent replaces the chemical spraying method with a laser irradiation method. Specifically, a laser beam is irradiated onto the edge region of the substrate to remove the film through ablation, eliminating the need for chemical solutions and spraying mechanisms. This substitution resolves the contradiction by providing precise film removal through controlled laser energy while avoiding the imprecision of chemical methods.
Solution Approach 2:
The patent utilizes controlled changes in laser parameters (irradiation intensity, pulse duration, wavelength) to achieve precise film removal. By adjusting these parameters, the laser can selectively remove the film from the edge region without affecting the main substrate area, thereby improving manufacturing precision while maintaining ease of implementation through automated laser control.
2Device complexity
If chemical spraying is used for film removal, then the process is simple, but contamination due to pin marks occurs on substrate surface
Solution Approach 1:
The patent replaces chemical spraying with laser irradiation to eliminate contamination. The laser beam removes the film through direct ablation without introducing chemical residues or pin marks on the substrate surface. This substitution maintains relatively simple process equipment while eliminating the harmful contamination effect.
3Productivity
If multiple unit pulse laser beams are irradiated onto the film, then film removal efficiency increases, but heat accumulation and deformation may occur in non-edge regions
Solution Approach 1:
The patent applies laser irradiation specifically to the edge region of the substrate where the film needs removal. By concentrating the laser beams only in the edge region and not irradiating the main substrate area, the method achieves high film removal efficiency at the edges while preventing heat accumulation and deformation in non-edge regions. This localized application resolves the contradiction between productivity and temperature control.
Solution Approach 2:
The patent divides the substrate treatment into distinct regions: the edge region requiring film removal and the main substrate region requiring protection. Multiple unit pulse laser beams are segmented and directed only at the edge region, allowing efficient film removal without affecting the main substrate. This spatial segmentation prevents heat accumulation in non-edge regions while maintaining high removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high-efficiency film removal with minimized film removed region and reduced heat-induced deformation, thereby enhancing production yield and preventing contamination.
Implementation Method 1
A method involving the irradiation of a plurality of unit pulse laser beams onto the edge region of a substrate, with a first irradiation operation followed by a second operation, to efficiently remove films while minimizing heat accumulation and deformation outside the edge region
Data Source
AI summary
Disclosed is a method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate. The method includes a first irradiation operation for irradiating a plurality of unit pulse laser beams onto the substrate while the substrate is rotating, and a second irradiation operation for irradiating a plurality of unit pulse laser beams to regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation.