Substrate Edge Film Removal Profiling for Width Error Diagnosis
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately removing the peripheral portion of photosensitive films from substrates, leading to errors in film formation and development processes due to inconsistencies in removal width profiles.
Innovation Solution
A substrate processing apparatus is designed with a periphery removal unit, profile acquisition unit, and factor estimation unit to remove the peripheral portion of the film, acquire the removal width profile, and output factor information indicating the error factors, enabling precise control and adjustment of the film removal process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional film removal methods are used without precise measurement, then the process is simpler and faster to implement, but the manufacturing precision of film removal width deteriorates
Solution Approach 1:
The patent replaces complex mechanical measurement systems with optical imaging and image processing. The imaging unit captures images of the substrate, and image processing automatically determines removal width, eliminating the need for physical measurement devices while achieving high precision
Solution Approach 2:
The system uses the substrate itself and its film removal pattern as the measurement reference. By imaging the actual removal pattern and comparing it against target specifications, the system performs self-diagnosis and self-adjustment without requiring external calibration standards or additional measurement artifacts
2Reliability
If film removal process is performed without error factor analysis, then the process control is simpler, but the reliability of film formation quality deteriorates
Solution Approach 1:
The patent implements a closed-loop feedback system where the imaging unit continuously monitors film removal width, the controller compares actual measurements against target values, identifies error factors, and automatically adjusts processing parameters. This feedback mechanism ensures consistent quality while maintaining manageable system complexity through automated control algorithms
Solution Approach 2:
The system performs preliminary error factor analysis by examining imaging data before final film formation is completed. By identifying potential errors early in the process and making corrections beforehand, the system prevents quality issues rather than detecting them after the fact, improving reliability without requiring overly complex real-time intervention systems
3Productivity
If manual inspection and correction of removal width is used, then the equipment complexity is reduced, but the productivity of substrate processing deteriorates
Solution Approach 1:
The patent replaces manual inspection and correction operations with automated imaging and control systems. The imaging unit automatically captures substrate images, software algorithms analyze removal width and identify errors, and the controller automatically adjusts processing parameters, eliminating the need for manual intervention while significantly increasing processing speed and throughput
Solution Approach 2:
The system creates digital copies (images) of the physical substrate and film removal pattern. By working with these digital representations for measurement and analysis, the system enables rapid automated processing without requiring physical measurement devices or manual handling, thereby increasing productivity while keeping the physical system relatively simple
Data Source
AI summary
A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.