Substrate Support Edge Ring Tilt Alignment

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Solution Overview

Problem

In substrate processing systems, the alignment of measurement devices such as spectral reflectometers can become misaligned over time, affecting the intensity and quality of the signals used to characterize substrates, leading to suboptimal processing conditions.

Innovation Solution

A moveable and adjustable edge ring and substrate support system, utilizing actuators and test substrates with contact fingers, allows for the tilting and positioning of the substrate to optimize the alignment of measurement devices by adjusting the orientation relative to the substrate support, thereby determining and correcting misalignment based on signal intensity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the measurement device is fixed in position, then the system structure is simple, but the alignment precision deteriorates over time due to misalignment

Engineering Contradiction:
Improvealignment precisionVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The substrate support is made adjustable with multiple degrees of freedom, allowing dynamic repositioning and tilting of the substrate relative to the measurement device. This enables alignment correction without moving the measurement device itself, resolving the contradiction between maintaining precision and avoiding system complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system performs self-alignment by using the substrate support's adjustment capabilities to compensate for misalignment. The substrate support actively corrects its own positioning relative to the measurement device through controlled movement and tilting, eliminating the need for complex external alignment mechanisms

Inventive Principle:
Principle #25Self-service

2Illumination intensity

If the measurement device alignment is not adjusted, then the system operation is simple, but the signal intensity deteriorates leading to suboptimal processing

Engineering Contradiction:
Improvesignal intensityVSAvoidalignment adjustment complexity
Core Design Contradiction:
Illumination intensityVSEase of operation

Solution Approach 1:

The system uses feedback from signal intensity measurements to automatically adjust the substrate support position and orientation. The measurement device detects signal intensity variations, and this information feeds back to control the substrate support adjustments, maximizing signal intensity without requiring manual alignment optimization

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The substrate support system automatically optimizes its own alignment with the measurement device by responding to signal intensity feedback. This self-adjusting capability improves signal intensity while maintaining ease of operation, as the system performs the optimization autonomously without complex manual intervention

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables precise adjustment of the measurement device alignment, ensuring optimal signal intensity and improving the accuracy of substrate characterization, which can lead to better process control and uniformity in substrate processing.

Implementation Method 1

A sensing device (e.g., a charge-coupled device, or CCD, a photodiode, etc.) is arranged to sense the signal reflected from the surface of the substrate

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS10312121B2Systems and methods for aligning measurement device in substrate processing systems
Publication Date: 2019.06.04 LAM RES CORP
  • US10312121B2 patent drawing
  • US10312121B2 patent drawing
  • US10312121B2 patent drawing

AI summary

A substrate support in a substrate processing system includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller. The controller, to selectively cause the edge ring to engage the substrate and tilt the substrate, controls at least one actuator to at least one of raise and lower the edge ring and raise and lower the inner portion of the substrate support. The controller determines an alignment of a measurement device in the substrate processing system based on a signal reflected from a surface of the substrate when the substrate is tilted.