Combined Substrate Edge Trimming with Eccentricity-Corrected Laser Positioning
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Solution Overview
Problem
In combined substrates where a first substrate and a second substrate are bonded, positional misalignment can hinder the appropriate removal of the peripheral portion of the first substrate during edge trimming, especially when both laser light radiation from the top and bottom sides is performed.
Innovation Solution
A processing method that involves acquiring the eccentric amount between the first and second substrates, forming a peripheral modification layer by radiating internal laser light along the boundary between the peripheral and central portions of the first substrate, and removing the peripheral portion starting from the modification layer, with the irradiation position of the laser light determined based on the eccentric amount.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is radiated from both top and bottom sides for edge trimming, then processing efficiency is improved, but positioning accuracy deteriorates due to eccentric misalignment between substrates
Solution Approach 1:
The patent measures the eccentric amount between the first and second substrates before performing laser processing. This preliminary measurement allows the system to pre-calculate and pre-position the laser irradiation paths, compensating for misalignment before the actual processing begins. By performing the positioning calculation in advance based on measured eccentricity, the system maintains high positioning accuracy while using dual-sided laser processing for improved efficiency.
Solution Approach 2:
The patent implements a feedback mechanism where the measured eccentric amount is used to adjust the laser irradiation positioning. The system continuously monitors the positional relationship between substrates and uses this information to dynamically correct the laser beam paths, ensuring accurate processing despite the benefits of dual-sided processing for increased productivity.
2Device complexity
If laser irradiation position is fixed without considering eccentricity, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The patent replaces complex mechanical positioning adjustments with computational methods. Instead of using adjustable mechanical components to compensate for eccentricity, the system uses software algorithms to calculate and correct irradiation positions based on measured eccentric amounts. This substitution maintains manufacturing precision while avoiding the complexity of additional mechanical adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables appropriate and uniform removal of the peripheral portion of the first substrate, even in cases of positional misalignment, by accurately determining the irradiation position of the laser light based on the eccentric amount between the substrates.
Implementation Method 1
forming, by radiating internal laser light along a boundary between a peripheral portion of the first substrate and a central portion of the first substrate, a peripheral modification layer serving as a starting point of separation of the peripheral portion
Data Source
AI summary
A processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other includes acquiring an eccentric amount between the first substrate and the second substrate; forming, by radiating internal laser light along a boundary between a peripheral portion of the first substrate and a central portion of the first substrate, a peripheral modification layer serving as a starting point of separation of the peripheral portion; and removing the peripheral portion starting from the peripheral modification layer. In the forming of the peripheral modification layer, an irradiation position of the internal laser light is determined based on the eccentric amount.