Substrate Edge Cleaning with Ultrasonic Water Film
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Solution Overview
Problem
Contaminants attached to the edge region of substrates during the coating and baking processes can cause defects in the exposure process of semiconductor and display devices.
Innovation Solution
A substrate processing apparatus and method utilizing ultrasonic oscillators to form protruding water films and nozzles to spray cleaning gas, effectively cleaning the edge region of substrates without immersion, combined with rotating supports to enhance contaminant removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is immersed in the cleaning liquid bath, then the cleaning effect is enhanced, but the substrate is damaged by the contaminants that have infiltrated into the liquid
Solution Approach 1:
The patent introduces an ultrasonic oscillator as an intermediary device that generates ultrasonic waves to create a water film protruding from the cleaning liquid surface. This water film acts as a mediator that contacts the substrate edge region for cleaning without requiring full immersion, thus preventing contaminant infiltration while maintaining cleaning effectiveness
Solution Approach 2:
The patent applies cleaning action locally only to the edge region of the substrate where contaminants are most problematic, rather than immersing the entire substrate. The ultrasonic oscillator creates a localized water film that targets the edge region specifically, providing localized cleaning quality without the harmful effects of full immersion
2Device complexity
If conventional cleaning methods are used, then the process is simple, but contaminants in the edge region cannot be effectively removed
Solution Approach 1:
The patent employs ultrasonic vibration from the ultrasonic oscillator to generate a water film that effectively removes contaminants from the substrate edge region. The mechanical vibration at ultrasonic frequencies enhances the cleaning capability, achieving superior edge region cleanliness while maintaining a relatively simple overall process structure
Solution Approach 2:
The patent utilizes hydraulic principles by creating a water film protruding from the cleaning liquid surface through ultrasonic vibration. This hydraulic approach allows the cleaning liquid to contact the substrate edge region in a controlled manner, effectively removing contaminants while preserving process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes contaminants from the edge regions of substrates, preventing defects in subsequent exposure processes and improving manufacturing quality.
Implementation Method 1
a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid
Data Source
AI summary
Provided is a substrate processing apparatus capable of effectively removing contaminants in an edge region of a substrate. The substrate processing apparatus comprises: a support configured to rotate a substrate; a first bath installed around the support and configured to store a cleaning liquid and form a first opening on an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and configured to provide an ultrasonic wave towards a surface of the cleaning liquid exposed by the first opening and form a first water film protruding from the surface of the cleaning liquid, wherein the substrate is not immersed in the first bath, and the edge region of the substrate is cleaned by the protruding first water film while rotating the substrate by the support.