Substrate Edge Film Removal with Width Error Factor Estimation
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Solution Overview
Problem
Existing substrate processing systems face challenges in accurately removing the peripheral portion of photosensitive films from substrates, leading to errors in film formation and processing due to variations in removal width, which are difficult to identify and correct.
Innovation Solution
A substrate processing apparatus with a periphery removal unit, profile acquisition unit, and factor estimation unit that removes the peripheral film, acquires the removal width profile, and outputs factor information on the error, allowing for precise identification and adjustment of the removal process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the peripheral portion of the film is removed by a predetermined width using a solvent nozzle, then the coating film is removed from the peripheral portion of the substrate, but the removal width varies due to positioning errors and substrate rotation variations
Solution Approach 1:
The system captures images of the substrate before and after film removal, automatically measures the actual removal width, compares it with the target width, and feeds back positioning correction information to adjust the nozzle position or substrate rotation speed for subsequent processing, thereby achieving precise control of removal width
Solution Approach 2:
The patent replaces manual positioning and measurement methods with an automated optical measurement system that uses image processing to detect the film removal boundary and calculate the actual removal width, substituting mechanical measurement tools with optical field-based detection
2Ease of operation
If the substrate is rotated during the film removal process, then the solvent can be uniformly supplied to the peripheral portion, but positioning errors occur between the substrate rotation and the nozzle movement
Solution Approach 1:
The system uses image processing to detect the actual position of the substrate relative to the nozzle during rotation, compares it with the intended position, and provides real-time feedback for position correction to maintain precise alignment
Solution Approach 2:
The imaging system serves multiple functions: it captures the substrate position during rotation, measures the film removal width after processing, and provides data for both positioning correction and quality inspection
3Measurement precision
If manual inspection and measurement of the film removal width is performed, then the removal state can be checked, but the process is time-consuming and labor-intensive
Solution Approach 1:
The patent replaces manual inspection and measurement with an automated optical measurement system that captures images and uses image processing algorithms to automatically detect the film removal boundary and calculate the removal width, eliminating the need for manual measurement tools and operations
Solution Approach 2:
The system performs self-inspection and self-measurement by automatically capturing images of the processed substrate, processing the images to determine removal width, and generating measurement results without requiring external inspection personnel or additional measurement equipment
Data Source
AI summary
A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.