Substrate Processing Liquid Ejection Position Correction
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Solution Overview
Problem
Existing substrate processing technologies face challenges in achieving consistent film removal widths due to variations in film properties such as hardness and thickness, as they do not account for individual film characteristics during the removal process.
Innovation Solution
A substrate processing apparatus and method that includes a property information acquisition unit to analyze film properties, a correction amount acquisition unit to adjust the ejection position of the processing liquid based on these properties, and a movement mechanism to correct the ejection position, ensuring precise removal width control by accounting for film type and physical properties like hardness and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed ejection position is used for processing liquid, then the device complexity is reduced, but the manufacturing precision of removal width deteriorates due to film property variations
Solution Approach 1:
The system changes the ejection position parameter based on film property parameters (hardness, thickness). The correction amount acquisition unit determines the appropriate ejection position by referencing stored correction amounts that correspond to different film properties, allowing precise removal width control adapted to each film type without requiring complex real-time adjustment mechanisms
Solution Approach 2:
The system performs preliminary acquisition of film property information before the removal process. The correction amount is determined in advance based on the measured film properties, and the ejection position is set accordingly before processing begins, enabling precise control without needing complex real-time adjustment mechanisms during the actual removal process
2Manufacturing precision
If the ejection position is adjusted for each film type, then the manufacturing precision improves, but the operation complexity increases
Solution Approach 1:
The system performs self-service by automatically acquiring film property information, determining the appropriate correction amount, and setting the ejection position without requiring manual intervention. The property information acquisition unit measures film properties, the correction amount acquisition unit automatically determines the correction based on stored data, and the system self-adjusts the ejection position, eliminating the need for operators to manually configure settings for different film types
Solution Approach 2:
The system uses feedback from film property measurements to automatically adjust the ejection position. The property information acquisition unit provides feedback about film characteristics, which the correction amount acquisition unit uses to determine the appropriate correction, creating a closed-loop system that automatically adapts to different film types without manual intervention
Data Source
AI summary
Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.