Substrate Processing Ejector for Pattern Collapse Prevention
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Solution Overview
Problem
Existing substrate processing technologies face challenges in efficiently replacing processing liquids with organic solvents due to increased risks of pattern collapse during the drying process, especially with miniaturized or high-aspect-ratio patterns, and inefficient solvent consumption.
Innovation Solution
A substrate processing apparatus with a gas ejector system that includes multiple nozzles arranged in tiers, where the ejection position of the organic solvent vapor is moved upward as the substrates are lifted, ensuring continuous and efficient supply of IPA vapor directly to the substrates, reducing pattern collapse and solvent consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are lifted from liquid processing tank to drying chamber, then processing liquid is replaced with organic solvent vapor, but pattern collapse occurs during drying process
Solution Approach 1:
The ejector supplies organic solvent vapor to substrates before they are fully lifted from the liquid processing tank, during the lifting process itself. This preliminary vapor supply prepares the substrate surface with a protective organic solvent layer before the high-temperature drying environment is applied, preventing pattern collapse during the subsequent drying phase
Solution Approach 2:
Organic solvent vapor acts as an intermediary substance between the liquid processing tank environment and the drying chamber environment. The vapor condenses on the substrate surface to form a protective layer that prevents direct contact between the substrate patterns and the harsh drying conditions, thereby preventing pattern collapse
2Productivity
If organic solvent vapor is supplied to substrates, then processing liquid is replaced efficiently, but solvent consumption increases
Solution Approach 1:
The ejector is positioned to supply organic solvent vapor locally and directly to the substrate surface area that requires treatment. The vapor supply is concentrated where it is most needed (on the substrate surface) rather than filling the entire chamber, improving replacement efficiency while minimizing overall solvent consumption
Solution Approach 2:
The ejector continuously supplies organic solvent vapor to the substrates throughout the lifting process and into the drying chamber, ensuring uninterrupted replacement of processing liquid. This continuous supply maintains optimal vapor concentration on substrate surfaces without requiring excessive solvent inventory in the chamber
3Productivity
If ejection position of vapor is fixed, then ejector structure is simple, but vapor supply efficiency decreases as substrates move up
Solution Approach 1:
The ejector's ejection position is made dynamic rather than fixed. The ejector moves vertically in synchronization with substrate movement, maintaining an optimal relative position to the substrate surface throughout the lifting process. This dynamic positioning ensures continuous efficient vapor supply without requiring complex multi-nozzle arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively replaces processing liquids with organic solvents, minimizing pattern collapse and solvent consumption by ensuring continuous vapor supply and optimizing the temperature difference for efficient IPA vapor condensation and adsorption.
Implementation Method 1
an ejector that ejects a vapor of an organic solvent toward portions of the plurality of substrates exposed from the liquid surface
Implementation Method 2
optimizing the temperature difference for efficient IPA vapor condensation and adsorption
Implementation Method 3
optimizing the temperature difference for efficient IPA vapor condensation and adsorption
Data Source
AI summary
A substrate processing apparatus includes a liquid processing tank, a movement mechanism, an ejector, and a controller. The liquid processing tank stores a processing liquid. The movement mechanism moves a plurality of substrates immersed in the liquid processing tank to above the liquid surface of the processing liquid. The ejector ejects a vapor of an organic solvent toward portions of the plurality of substrates exposed from the liquid surfaces. The controller moves up the ejection position of the vapor of the organic solvent by the ejection unit as the plurality of substrates are moved up.