Substrate Electric-Field Alignment for Uniform QNED Nanorods

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Solution Overview

Problem

In the manufacturing of QNED displays, nanorods supplied onto thin-film transistors are in a randomly-oriented state, leading to reduced luminous efficiency and sharpness, and there is a risk of substrate damage during handling and voltage application.

Innovation Solution

A substrate treating apparatus with a liquid supply unit for nanorods and a voltage application unit that applies a controlled electric field to orient nanorods uniformly, using shock-absorbing members to minimize substrate damage and collision risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If nanorods are supplied onto the thin-film transistor without orientation control, then the manufacturing process is simple, but the luminous efficiency and sharpness of the manufactured QNED are deteriorated

Engineering Contradiction:
Improvenanorod supply processVSAvoidnanorod orientation uniformity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies a preliminary orientation treatment to the substrate before nanorod deposition. The orientation treatment unit pre-orientates the substrate surface, which then guides the nanorods to align uniformly during the subsequent supply process, resolving the contradiction between simple manufacturing and precise orientation

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an orientation treatment unit as an intermediary between the substrate and nanorod supply process. This intermediary unit prepares the substrate surface with specific orientation properties that facilitate uniform nanorod alignment, enabling both simple manufacturing and high precision orientation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If voltage is applied directly to the substrate without pressure buffering, then the nanorod orientation is achieved, but the substrate may be damaged due to pressure transfer

Engineering Contradiction:
Improvenanorod orientationVSAvoidsubstrate damage from pressure
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a cushioning member between the voltage application pin and the substrate. This cushioning member absorbs and buffers the pressure generated during voltage application, preventing direct pressure transfer to the substrate while maintaining the electric field necessary for nanorod orientation

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of operation

If the substrate is handled during loading and unloading without collision protection, then the handling process is simple, but the substrate may collide with the base and be damaged

Engineering Contradiction:
Improvesubstrate handlingVSAvoidsubstrate collision damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies a preliminary protective coating or treatment to the substrate that prevents direct contact and collision with the base during loading and unloading operations. This preliminary protection measures counteracts the potential harmful collision before it occurs, maintaining both simple handling and substrate integrity

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enhances luminous efficiency and sharpness of QNED displays by orienting nanorods uniformly and minimizes substrate damage and collision risks during handling.

Implementation Method 1

a voltage application unit for generating an electric field on the substrate to uniformly orient the light-emission sources supplied onto the substrate

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

a shock-absorbing member for absorbing a pressure to be transferred to the substrate when the voltage application pin comes into contact with the substrate

Methodology Applied
Scientific EffectShock absorption: Damping

Data Source

PatentUS12376422B2Apparatus for treating substrate
Publication Date: 2025.07.29 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12376422B2 patent drawing
  • US12376422B2 patent drawing
  • US12376422B2 patent drawing

AI summary

Disclosed is a substrate treating apparatus. The apparatus includes a liquid supply unit for supplying light-emission sources and/or a treating liquid onto the substrate, and a voltage application unit for applying a voltage to the substrate on which the light-emission sources have been supplied.