Dielectric Substrate Electrical Characterization Device
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Solution Overview
Problem
Existing methods for characterizing the electrical performance of substrates for microelectronic and RF devices are slow, costly, destructive, and unsuitable for automated production control, as they require forming test structures on the substrate and cannot provide a comprehensive mapping of electrical characteristics across the entire surface.
Innovation Solution
A device and method for measuring electrical characteristics using a dielectric support with a flush contact surface and connection bump contacts, allowing for non-destructive, rapid, and automated characterization of substrates by positioning an electrical test structure in close contact with the substrate, enabling the measurement of RF or static characteristics across the entire surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If test structures are formed on the substrate using microelectronic fabrication means, then electrical characteristics can be measured, but the process becomes slow, costly, and destructive
Solution Approach 1:
The patent uses a measurement device that copies the test structure onto the substrate temporarily for measurement, then removes it without damaging the substrate. This allows rapid, non-destructive measurement by creating and removing temporary test patterns rather than permanently fabricating test structures.
Solution Approach 2:
The patent introduces a measurement device as an intermediary between the substrate and the measurement process. This device contains the test structure pattern and transfers it to the substrate temporarily, enabling measurement without requiring permanent substrate modification or complex fabrication equipment.
2Measurement precision
If test structures are formed on the substrate, then electrical characteristics can be measured, but the process becomes destructive and unsuitable for production control
Solution Approach 1:
The measurement device creates a temporary copy of the test structure on the substrate, performs measurement, then removes the test structure without damaging the substrate. This copying approach enables measurement while preserving substrate integrity for subsequent production steps.
Solution Approach 2:
The patent employs temporary test structures that are discarded after measurement and the substrate recovered for normal production use. The test structure is formed, measured, then removed, allowing the substrate to be reused without permanent modification or damage.
3Measurement precision
If separate tests are performed for each electrical characteristic, then comprehensive characterization can be achieved, but the process becomes time-consuming and complex
Solution Approach 1:
The measurement device merges multiple measurement capabilities into a single integrated system. The same device that forms the test structure also performs electrical measurements, combining fabrication and characterization functions to reduce time and complexity.
Solution Approach 2:
The measurement device is designed with universal functionality to perform multiple types of electrical measurements (resistance, capacitance, inductance, S-parameters) using the same test structure and measurement platform, eliminating the need for separate specialized equipment for each characteristic.
4Measurement precision
If local measurement of electrical characteristics is performed, then specific points can be characterized, but comprehensive surface mapping cannot be achieved
Solution Approach 1:
The measurement device is designed to be movable and repositionable across the substrate surface. The device can dynamically move to different locations, form test structures at each position, perform measurements, and record data to create a comprehensive spatial map of electrical characteristics across the entire substrate.
Solution Approach 2:
The measurement device performs automated sequential measurements across multiple locations on the substrate. The system self-manages the process of moving to different positions, forming test structures, measuring characteristics, and compiling results into a comprehensive surface map without requiring manual intervention at each location.
Data Source
AI summary
The disclosure relates to a device for measuring an electrical characteristic of a substrate comprising a support made of a dielectric material having a bearing surface, the support comprising an electrical test structure having a contact surface flush with the bearing surface of the support, the bearing surface of the support and the contact surface of the electrical test structure being suitable for coming into close contact with a substrate. The measurement device also comprises at least one connection bump contact formed on another surface of the support and electrically linked to the electrical test structure. This disclosure also relates to a system for characterizing a substrate and a method for measuring a characteristic of a substrate employing the measurement device.