Electronic Device Substrate Electrical Connection Narrowing Frame Width
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Solution Overview
Problem
Existing display devices face challenges in narrowing the frame width due to the complexity of connecting conductive layers across substrates, which affects the reliability and cost-effectiveness of the display panel configuration.
Innovation Solution
The implementation of a display device configuration that includes a first substrate with a first conductive layer, a second substrate with a third conductive layer and a penetrating hole, and a connecting material that electrically connects the second conductive layer to the third conductive layer via the hole, allowing for direct contact and expanding the contact area to enhance reliability and reduce frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring board is used to connect conductive layers across substrates, then electrical connection is achieved, but the frame width increases and device complexity increases
Solution Approach 1:
The patent extracts the electrical connection function from a separate wiring board and integrates it directly into the substrate structure through conductive holes and connecting conductors. This eliminates the need for an additional wiring board component while maintaining reliable electrical connections between conductive layers on opposite substrates.
Solution Approach 2:
The patent merges the functions of the wiring board, conductive holes, and connecting conductors into a unified integrated structure within the substrate. The conductive holes penetrating the substrate and the connecting conductors formed within these holes combine to create a direct electrical pathway, eliminating the need for separate wiring board components and reducing overall device complexity.
2Reliability
If multiple wiring boards and connectors are used to connect conductive layers, then electrical connection is achieved, but device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the electrical connection function from external wiring boards and connectors and integrates it directly into the substrate structure. Conductive holes penetrating the substrate and connecting conductors formed within these holes provide direct electrical pathways, eliminating the need for separate wiring board components and reducing device complexity.
Solution Approach 2:
The patent merges the functions of wiring boards, connectors, and conductive pathways into a unified integrated structure. The conductive holes and connecting conductors are formed as part of the substrate manufacturing process, combining multiple functions into a single integrated component that reduces both device complexity and manufacturing steps.
3Length of moving object
If conductive layers are connected through a hole in the substrate, then frame width is reduced, but electrical connection reliability may be compromised
Solution Approach 1:
The patent introduces connecting conductors as intermediary elements within the conductive holes to ensure reliable electrical connection. These connecting conductors, formed by filling the conductive holes with conductive material, serve as mediators that bridge the electrical pathway between conductive layers on opposite substrates, maintaining reliability while achieving narrow frame width.
Solution Approach 2:
The patent changes the physical and chemical parameters of the connecting conductors by controlling the filling process and material properties. By optimizing the conductive material composition, filling density, and thermal treatment parameters, the patent ensures high electrical conductivity and mechanical strength of the connecting conductors, achieving reliable electrical connection through the substrate holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the reliable electrical connection between conductive layers, reduces the need for additional wiring boards, and narrows the frame width while improving the overall cost-effectiveness of the display device.
Implementation Method 1
a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole
Data Source
AI summary
According to one embodiment, an electronic device including a first substrate which includes a first basement, a first conductive layer, and a second conductive layer in contact with the first conductive layer, a second substrate which includes a second basement opposed to the first conductive layer and separated from the first conductive layer, a third conductive layer, and a first hole penetrating the second substrate, and a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole and directly contacts the second conductive layer.