Substrate Processing Apparatus with Dynamic Electrode Connection
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Solution Overview
Problem
Existing substrate processing apparatuses for semiconductor manufacturing lack efficient temperature control and uniform processing of chemical liquids on substrates, leading to suboptimal processing results due to reliance on fluid or gas heating methods.
Innovation Solution
A substrate processing apparatus featuring a rotary table with a circular attraction plate and a hot plate, where the attraction plate is made of high thermal conductivity materials and has independently controllable heating zones, allowing for precise temperature control of the substrate through heat conduction and agitation of the chemical liquid during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fluid or gas heating methods are used to heat the substrate, then the substrate can be heated, but the temperature control accuracy is insufficient and processing uniformity is poor
Solution Approach 1:
The patent replaces fluid or gas heating methods with direct electrical heating through electrode contact. The power feeding electrode directly contacts the power receiving electrode on the substrate, transmitting electrical energy that generates heat through Joule heating, achieving precise temperature control and uniform processing.
Solution Approach 2:
The patent utilizes Joule heating effect where electrical energy transitions to thermal energy through the resistance of the substrate and electrodes. This phase transition from electrical to thermal energy enables accurate and uniform temperature control during substrate processing.
2Adaptability or versatility
If the power feeding electrode and power receiving electrode are always connected, then power can be continuously supplied, but the system lacks flexibility for processing variations
Solution Approach 1:
The patent employs a dynamic electrode connection system where the electrode moving device can adjust the connection state between power feeding electrode and power receiving electrode. The system can switch between connected and disconnected states, providing processing flexibility while maintaining power supply reliability when connected.
Solution Approach 2:
The electrode moving device acts as an intermediary mechanism that controls the connection and disconnection between electrodes. This mediator enables flexible adjustment of power supply based on processing requirements while ensuring stable power transmission when connection is needed.
3Manufacturing precision
If a single heating zone is used, then the structure is simple, but temperature uniformity across the substrate cannot be controlled
Solution Approach 1:
The patent divides the heating system into multiple independently controllable heating zones. Each zone can be controlled separately to achieve uniform temperature distribution across the substrate, improving manufacturing precision despite increased structural complexity.
Solution Approach 2:
The patent implements different heating characteristics in different zones of the substrate. Each heating zone can be independently controlled to provide optimal temperature for specific processing requirements in different areas, achieving local quality optimization and overall temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate temperature control and uniform processing of substrates, improving the efficiency and effectiveness of chemical liquid processing by maintaining high thermal conductivity and independent zone control, thus enhancing the reaction between the substrate and chemical liquid.
Implementation Method 1
the substrate is heated by a fluid (a processing liquid and/or a gas) existing between the substrate and the heater
Implementation Method 2
an electric heater provided at the rotary table to be rotated along with the rotary table and configured to heat the substrate placed on the rotary table
Data Source
AI summary
A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.