Substrate-Embedded Component Heat Dissipation via Vertical Vias
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrate-embedded electronic components face issues with shortened lifespan and performance deterioration due to heat generation, requiring effective heat dissipation solutions without increasing the overall size of the substrate.
Innovation Solution
The substrate-embedded electronic component design includes a core layer with through-portions for electronic components, an encapsulant covering these components, and a conductive structure connecting through-vias and metal layers for efficient heat dissipation, utilizing the core layer's thickness for heat dissipation without expanding the substrate's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrate-embedded electronic components are used to achieve miniaturization and thinning, then device size is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by utilizing the vertical thickness of the core layer. Through-vias penetrating the core layer create vertical heat conduction paths, allowing heat to be dissipated in the thickness direction rather than only in the planar direction, thus resolving the heat dissipation issue while maintaining miniaturization.
Solution Approach 2:
The patent embeds through-vias and conductive structures within the core layer thickness, nesting heat dissipation elements inside the existing substrate structure. The through-vias are formed by penetrating the core layer and filling with conductive material, creating a nested configuration that utilizes the core layer's internal space for heat dissipation without increasing external dimensions.
2Temperature
If heat dissipation structures are added to embedded components, then heat dissipation performance improves, but device complexity increases
Solution Approach 1:
The through-vias serve multiple functions: they provide electrical connection between different layers and simultaneously act as heat dissipation pathways. The conductive material filling the through-vias performs both electrical conduction and thermal conduction, eliminating the need for separate heat dissipation structures and reducing overall device complexity.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single through-via structure. By filling the through-vias with conductive material that has both electrical and thermal conductivity, the design combines multiple functions into one element, simplifying the overall structure while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance, prolonging the component's lifespan and maintaining the substrate's size, effectively addressing heat-related performance issues.
Implementation Method 1
a conductive structure embedded in the encapsulant connecting the through-via and the electronic component to each other. The conductive structure and the metal layer are made of different materials
Data Source
AI summary
A substrate-embedded electronic component includes a first core layer, a first through-portion penetrating the first core layer, a first electronic component disposed in the first through-portion, an encapsulant disposed in at least a portion of the first through-portion, and covering at least a portion of the first electronic component, a second core layer disposed on the encapsulant, and a first through-via penetrating the second core layer, wherein the first through-via is connected to the first electronic component.