Multi-Layer Substrate Reducing Emission and Heat
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Solution Overview
Problem
Existing multi-layer substrates for electronic devices suffer from undesired electromagnetic conductive emission and poor heat transfer due to parasitic capacitance and thick insulating layers, which hinder efficient electromagnetic shielding and thermal conductivity.
Innovation Solution
A low conductive emission substrate is designed with multiple thin high dielectric strength insulating layers separated by conductive layers, where one conductive layer is electrically coupled to another, reducing parasitic capacitance and enhancing thermal conductivity by using pulsed laser deposition or E-beam deposition techniques for materials like silicon carbide and copper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick insulating layer is used, then insulation performance is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The single thick insulating layer is segmented into multiple thin insulating layers separated by conductive layers. This segmentation allows the insulating function to be maintained while introducing thermal conduction paths through the conductive layers, resolving the contradiction between insulation performance and heat transfer efficiency.
2Device complexity
If a single conductive layer is used, then device complexity is reduced, but electromagnetic emission increases
Solution Approach 1:
The single conductive layer is segmented into multiple conductive layers at different positions within the multi-layer substrate. These segmented conductive layers work together to shield electromagnetic emissions while maintaining a relatively simple overall structure, resolving the contradiction between device complexity and electromagnetic emission control.
Solution Approach 2:
Insulating layers are introduced as intermediary elements between conductive layers and the ground structure. These intermediary insulating layers reduce parasitic capacitance and thereby reduce electromagnetic conductive emission, while the conductive layers provide electromagnetic shielding, collectively resolving the emission problem without excessive complexity.
3Reliability
If multiple insulating layers are used, then insulation performance is improved, but manufacturing complexity increases
Solution Approach 1:
Multiple insulating layers and conductive layers are merged into a single integrated multi-layer substrate structure manufactured through a unified process. This merging approach achieves improved insulation performance while avoiding the need for separate assembly steps, thereby maintaining ease of manufacture.
Solution Approach 2:
The thickness parameters of insulating and conductive layers are optimized to achieve the desired insulation performance with thin layers, reducing the overall number of layers needed and simplifying the manufacturing process while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electromagnetic emission by 1,000 times and improves heat transfer efficiency, providing effective electromagnetic shielding and thermal conductivity for electronic components.
Implementation Method 1
a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers
Implementation Method 2
improves heat transfer efficiency, providing effective electromagnetic shielding and thermal conductivity for electronic components
Implementation Method 3
using pulsed laser deposition or E-beam deposition techniques for materials like silicon carbide and copper
Implementation Method 4
using pulsed laser deposition or E-beam deposition techniques for materials like silicon carbide and copper
Data Source
AI summary
According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers.