Semiconductor Substrate Cleaning with Segmented End Portion Scrubbing
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Solution Overview
Problem
In semiconductor manufacturing, abrasive particles from the CMP process often adhere to the substrate and are difficult to remove, leading to decreased yield due to deposits forming around them, especially at the substrate's end portions, where conventional scrub cleaning is ineffective.
Innovation Solution
A semiconductor manufacturing apparatus incorporating a second cleaner with end portion cleaners that physically contact and remove abrasive particles from the substrate's end portions using a foamed melamine resin and elastic materials, allowing for reliable removal without cleaning agents and minimizing substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If scrub cleaning with PVA is performed after CMP, then abrasive particles on the main surface are removed, but abrasive particles at end portions remain and are firmly fixed during drying
Solution Approach 1:
The cleaning apparatus is divided into two distinct cleaning units: a first cleaner for the main surface and a second cleaner for end portions. This segmentation allows each unit to be optimized for its specific cleaning task, with the second cleaner specifically targeting the previously problematic end portion areas that the first cleaner could not effectively reach.
Solution Approach 2:
Different cleaning mechanisms are applied to different locations of the substrate. The first cleaner uses a soft roller for the main surface, while the second cleaner uses a brush or cloth for end portions. This local differentiation ensures that each area is cleaned by the most appropriate method for its specific geometry and contamination characteristics.
2Ease of manufacture
If conventional scrub cleaning is used, then cleaning agents can remove some particles, but end portions are not effectively cleaned and particles become firmly fixed
Solution Approach 1:
The cleaning process is segmented into two sequential stages: first cleaner for the main surface and second cleaner for end portions. This ensures that no area is overlooked and that each region receives the appropriate cleaning treatment, eliminating the incompleteness issue of conventional single-stage cleaning.
Solution Approach 2:
The second cleaner acts as an intermediary cleaning step that specifically addresses the end portions that the first cleaner cannot effectively reach. This intermediate cleaning action ensures complete particle removal from all substrate areas before the drying process begins.
3Productivity
If abrasive particles remain on substrate, then deposits form around particles, but removing particles requires additional cleaning steps
Solution Approach 1:
The dual cleaner system performs preliminary cleaning of both the main surface and end portions before the substrate enters the drying process. By removing abrasive particles beforehand, the system prevents the formation of deposits that would otherwise occur during drying, eliminating the need for additional post-drying cleaning steps.
Solution Approach 2:
The invention converts the potential harm of abrasive particle adhesion into a benefit by using the controlled cleaning process to remove particles before they can cause deposit formation. The cleaning agents and mechanical action work together to eliminate particles that would otherwise become harmful deposit nuclei during subsequent processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes abrasive particles from the substrate's end portions, reducing the likelihood of deposits forming and improving yield by ensuring fewer particles remain post-processing.
Implementation Method 1
a second cleaner configured to rub an end portion of the semiconductor substrate with a physical contact
Implementation Method 2
A semiconductor manufacturing apparatus incorporating a second cleaner with end portion cleaners that physically contact and remove abrasive particles from the substrate's end portions using a foamed melamine resin and elastic materials
Data Source
AI summary
A semiconductor manufacturing apparatus according to an embodiment includes a first cleaner and a second cleaner. The first cleaner polishes a semiconductor substrate or a polishing target material on the semiconductor substrate with an abrasive and then cleans a top face of the semiconductor substrate or of the polishing target material while the semiconductor substrate is rotated. The second cleaner rubs an end portion of the semiconductor substrate with a physical contact according to rotation of the semiconductor substrate.