Substrate Etching with Acid Polymer Film for Precise Oxide Removal
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Solution Overview
Problem
Existing substrate processing methods require large amounts of chemical liquids, leading to environmental concerns and inefficiencies in etching accuracy due to continuous flow requirements.
Innovation Solution
A substrate processing method that alternately forms and removes an oxide layer using a polymer film containing an acid polymer, which stays on the substrate, reducing the need for continuous acid polymer supply and allowing controlled etching with reduced chemical usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If continuously-flowing diluted hydrofluoric acid is used to remove metal oxide layer, then the oxide layer removal is effective, but a large amount of chemical liquid is required causing environmental load
Solution Approach 1:
The patent changes the physical state of the etching agent from liquid to solid polymer form. The acid polymer is applied as a coating that remains on the substrate surface, eliminating the need for continuous liquid flow. This parameter change from liquid to solid state allows the etching action to occur without requiring large quantities of chemical liquid.
Solution Approach 2:
The acid polymer coating is applied as a thin layer that is consumed during the etching process. Instead of continuously supplying large amounts of liquid etchant, a controlled amount of acid polymer is deposited and used up during etching, reducing overall chemical consumption while maintaining effective oxide removal.
2Manufacturing precision
If repeatedly forming and removing metal oxide layer is performed to achieve accurate etching, then etching accuracy is improved, but the process requires continuous supply of chemical liquids increasing complexity
Solution Approach 1:
The patent combines the oxide formation and etching steps into a more integrated process. By using acid polymer coating that is applied and then activated (through heating or solvent treatment), the process reduces the number of separate chemical supply systems needed while maintaining the iterative oxide formation and removal cycle for precise etching control.
Solution Approach 2:
The patent maintains the periodic nature of the etching process by repeatedly forming oxide layers and removing them with acid polymer coatings. Each cycle involves depositing a fresh acid polymer layer, activating it, performing etching, and then removing the polymer, creating a controlled periodic action that achieves precise etching without continuous chemical flow.
3Productivity
If liquid etching agent is continuously supplied to maintain etching action, then etching continues effectively, but the substance consumption increases significantly
Solution Approach 1:
The patent changes the delivery mechanism from continuous liquid flow to periodic solid polymer deposition. The acid polymer is applied as a coating that releases etching action over time through activation (heating or solvent treatment), maintaining etching efficiency without the continuous substance consumption associated with liquid flow systems.
Solution Approach 2:
The acid polymer coating provides continuous etching action once applied and activated. The polymer remains on the substrate surface and continues to etch the oxide layer without requiring additional chemical supply, maintaining productive etching action while eliminating the need for continuous chemical flow and associated substance consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate etching with minimized chemical consumption, improving process efficiency and reducing environmental impact by using a semisolid or solid polymer film for oxide layer removal.
Implementation Method 1
removing the oxide layer by the acid polymer contained in the polymer film
Implementation Method 2
evaporating the alkali component from the polymer film after the polymer film is formed
Implementation Method 3
it is possible to facilitate ionization of the acid polymer contained in the polymer film by the action of the electroconductive polymer
Data Source
AI summary
A substrate processing method etches a substrate. The substrate processing method includes an oxide layer forming step of oxidizing a surface layer portion of a major surface of the substrate and forming an oxide layer and an oxide layer removing step of forming a polymer film that contains an acid polymer on the major surface of the substrate and removing the oxide layer by the acid polymer contained in the polymer film. The oxide layer forming step and the oxide layer removing step are alternately repeated.