Substrate Processing Embankment for Etching Temperature Uniformity
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Solution Overview
Problem
In semiconductor manufacturing, single-substrate type wet etching processes face challenges in maintaining temperature uniformity of etching liquids across the substrate surface, leading to degraded in-surface uniformity due to heat absorption and evaporation, resulting in non-uniform etching processing.
Innovation Solution
A substrate processing apparatus with an embankment mechanism that surrounds the substrate to block the outflow of etching liquid, using a dual-structured embankment with high thermal conductivity and insulation materials to maintain temperature uniformity, and a moving mechanism to adjust the embankment height based on the etching liquid's properties and temperature distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is rotated and processing liquid is supplied onto the central portion, then the processing liquid can be supplied efficiently, but the temperature uniformity across the substrate surface deteriorates due to heat absorption and evaporation
Solution Approach 1:
An embankment structure is introduced as an intermediary element between the substrate and the environment. This embankment prevents direct heat exchange between the processing liquid and the surrounding air, acting as a thermal barrier that maintains temperature uniformity while allowing the liquid supply process to continue efficiently
Solution Approach 2:
The embankment creates a closed or semi-closed environment around the substrate, effectively isolating the processing liquid from external thermal influences. This inert environment prevents heat loss through evaporation and convection, maintaining consistent temperature across the substrate surface
2Reliability
If the embankment height is increased to suppress liquid outflow, then the liquid retention improves, but the device complexity increases
Solution Approach 1:
The embankment height is made adjustable rather than fixed, allowing the system to adapt to different processing requirements. The moving mechanism enables dynamic adjustment of the embankment position, providing optimal liquid retention while maintaining operational flexibility and reducing overall system complexity
Solution Approach 2:
The embankment height parameter can be changed based on processing conditions. By adjusting the embankment position, the system optimizes liquid retention for different substrate sizes, liquid flow rates, and processing requirements without requiring multiple fixed-structure embankments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves temperature uniformity of the etching liquid across the substrate surface, enhancing in-surface uniformity of the etching processing by maintaining a consistent liquid film thickness and reducing temperature differences between the central and peripheral portions.
Implementation Method 1
The first member 611 is made of a material having a high thermal conductivity
Implementation Method 2
The second member 612 is made of a material having high heat insulation property
Implementation Method 3
supplying, while rotating the substrate, a processing liquid such as an etching liquid onto a central portion of the substrate being rotated
Data Source
AI summary
A substrate processing apparatus includes a placing unit, a supply, an embankment and a moving mechanism. The placing unit is configured to place a substrate thereon. The supply is configured to supply a processing liquid onto the substrate placed on the placing unit. The embankment is disposed to surround the substrate placed on the placing unit to suppress an outflow of the processing liquid supplied onto the substrate from the substrate. The moving mechanism is configured to vary a height of the embankment.