Substrate Etching Nozzle Scan Uniformity Control
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Solution Overview
Problem
Existing substrate processing methods face challenges in achieving uniform etching across the surface of substrates due to temperature differences and non-uniform etching liquid distribution, leading to variations in etching amounts at different positions.
Innovation Solution
A substrate processing apparatus and method that includes a holding device, a rotation device, a supply device with a nozzle for etching liquid, and a control device to execute a continuous scan process, moving the nozzle back and forth between a first and second position on the substrate's outer peripheral side, while changing the first position to distribute the etching liquid uniformly and reduce temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a continuous scan process is used to supply etching liquid to the substrate, then the etching liquid distribution is improved, but temperature differences and non-uniform etching amounts still occur at different positions
Solution Approach 1:
The continuous scan process is divided into multiple discrete scan lines that are sequentially executed. Each scan line supplies etching liquid to a specific radial position on the substrate, segmenting the overall etching process into multiple passes. This segmentation allows for better control of liquid distribution and temperature management across different regions of the substrate surface.
Solution Approach 2:
The nozzle is dynamically moved between different radial positions on the substrate during multiple scan lines. The movement device adjusts the nozzle position in the radial direction for each scan line, creating a dynamic etching process that adapts to different positions on the substrate. This dynamic positioning ensures uniform etching by distributing the etching liquid supply across multiple positions rather than concentrating it at a single location.
2Manufacturing precision
If the nozzle remains stationary at one position during etching, then the device complexity is reduced, but the etching liquid distribution becomes non-uniform
Solution Approach 1:
The nozzle is dynamically moved between different radial positions on the substrate during multiple scan lines. The movement device adjusts the nozzle position in the radial direction for each scan line, creating a dynamic etching process that adapts to different positions on the substrate. This dynamic positioning ensures uniform etching by distributing the etching liquid supply across multiple positions rather than concentrating it at a single location.
Solution Approach 2:
The etching process continues without interruption through multiple sequential scan lines. The nozzle continuously supplies etching liquid while moving between different radial positions, maintaining a continuous useful action throughout the substrate surface. This continuous process ensures complete coverage and uniform etching without stopping or pausing the etching liquid supply.
3Manufacturing precision
If multiple scan lines are executed with different first positions, then the in-plane uniformity is improved, but the processing time increases
Solution Approach 1:
The continuous scan process is divided into multiple discrete scan lines that are sequentially executed. Each scan line supplies etching liquid to a specific radial position on the substrate, segmenting the overall etching process into multiple passes. This segmentation allows for better control of liquid distribution and temperature management across different regions of the substrate surface.
Solution Approach 2:
The etching process continues without interruption through multiple sequential scan lines. The nozzle continuously supplies etching liquid while moving between different radial positions, maintaining a continuous useful action throughout the substrate surface. This continuous process ensures complete coverage and uniform etching without stopping or pausing the etching liquid supply.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The continuous scan process improves in-plane uniformity of the etching process by dispersing the etching liquid supply points and adjusting the movement speed of the nozzle, thereby reducing the etching amount variations and enhancing the uniformity of the etching process across the substrate surface.
Implementation Method 1
a rotation device that rotates the holding device such that the substrate held by the holding device is rotated
Implementation Method 2
a supply device that includes a nozzle and supplies an etching liquid from the nozzle to the substrate held by the holding device
Implementation Method 3
a movement device that moves the nozzle of the supply device with respect to the substrate held by the holding device, wherein a control device includes circuitry that executes a scan process in which the circuitry controls the rotation device, the movement device and the supply device such that while the etching liquid is supplied from the nozzle to the substrate being rotated by the rotation device, the nozzle is moved back and forth over the substrate between a first position and a second position
Data Source
AI summary
A substrate processing apparatus includes a holding device that holds a substrate horizontally, a rotation device that rotates the holding device such that the substrate held by the holding device is rotated, a supply device that includes a nozzle and supplies etching liquid from the nozzle to the substrate held by the holding device, a movement device that moves the nozzle with respect to the substrate held by the holding device, and a control device including circuitry that executes a scan process in which the circuitry controls the rotation, movement and supply devices such that while the liquid is supplied from the nozzle to the substrate, the nozzle is moved back and forth over the substrate between first and second positions on outer peripheral side of the substrate relative to the first position. The circuit of the control device executes the scan process multiple times while changing the first position.