Substrate Etching Vertical Uniformity via Temperature Gradient
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Solution Overview
Problem
Conventional substrate processing methods face challenges in achieving uniform etching patterns due to uneven etchant replacement, where the lower portions of patterns are excessively etched compared to the upper portions, leading to vertical direction non-uniformity.
Innovation Solution
A substrate processing method that includes an etching process, a temperature-difference forming process, and a rinsing process, where the temperature in the lower portions of the patterns is made lower than in the upper portions during etching, and rinse liquid is supplied to replace the etchant, ensuring uniform etching by reducing reactivity in lower portions and enhancing rinsing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If rinse liquid is supplied to replace etchant on the substrate, then the rinsing process completes the etching replacement, but the lower portions of patterns are excessively etched compared with the upper portions due to delayed etchant replacement in gaps
Solution Approach 1:
The patent changes the temperature parameter of the etchant to create a temperature gradient across the pattern structure. By making the etchant temperature lower than the substrate temperature, the etching reaction rate is reduced in the lower portions of patterns where etchant resides longer, compensating for the delayed rinsing in gap regions and achieving vertical uniformity in etching depth
2Manufacturing precision
If etchant is supplied onto the substrate to etch the pattern, then the etching process removes material to form patterns, but the etchant penetrates deeply into gaps between patterns causing non-uniform etching
Solution Approach 1:
The patent introduces temperature as a control parameter for the etching process. By controlling the etchant temperature to be lower than the substrate temperature, the etching rate is modulated spatially - slower at the bottom of patterns where etchant remains longer, and faster at the top where rinsing is more effective - thereby achieving uniform overall etching depth without complex mechanical modifications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the vertical uniformity of etching patterns by reducing etching in lower portions and approximating the etching amount to that of the upper portions, thereby improving the overall uniformity of pattern processing.
Implementation Method 1
a temperature in a lower portion of the pattern lower than a temperature in an upper portion of the pattern
Implementation Method 2
an etching process for processing patterns on a substrate by supplying an etchant onto the substrate
Implementation Method 3
a rinsing process for replacing the etchant remaining on the substrate with rinse liquid
Data Source
AI summary
A substrate processing method according to an embodiment includes an etching process, a temperature-difference forming process, and a rinsing process. The etching process supplies an etchant onto a first surface of a substrate on which a pattern is formed to etch the pattern. The temperature-difference forming process makes, in parallel with the etching process, a temperature in a lower portion of the pattern lower than a temperature in an upper portion of the pattern. The rinsing process supplies rinse liquid onto the first surface after the etching process to replace the etchant remaining on the pattern with the rinse liquid.