Substrate Etching Control Using Peripheral Temperature Mapping
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Solution Overview
Problem
Conventional etching treatments for substrates only monitor the substrate surface temperature, neglecting the influence of ambient temperature, which can lead to defects due to radiant heat from surrounding members.
Innovation Solution
A substrate treatment device that includes a temperature distribution acquisition unit using a thermographic camera to capture the temperature distribution around the substrate, a feature value calculator to determine the etching amount based on this distribution, and a determination unit to assess the quality of the etching process, ensuring uniform etching by adjusting the temperature and schedule accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If only substrate surface temperature is monitored, then the monitoring system remains simple, but etching defects occur due to radiant heat from surrounding members
Solution Approach 1:
The patent transitions from one-dimensional substrate surface temperature monitoring to two-dimensional temperature distribution measurement by incorporating ambient temperature monitoring in the peripheral area surrounding the substrate. This dimensional expansion enables comprehensive thermal field analysis including radiant heat effects from surrounding members.
Solution Approach 2:
The temperature distribution acquisition unit is designed to perform multiple functions: acquiring substrate surface temperature, acquiring ambient temperature in peripheral areas, and calculating both substrate temperature and feature values related to etching amount. This multi-functional approach resolves the contradiction by comprehensive monitoring without proportionally increasing system complexity.
2Manufacturing precision
If ambient temperature monitoring is added, then etching quality improves by preventing radiant heat defects, but device complexity increases
Solution Approach 1:
The patent implements feedback control by acquiring ambient temperature distribution, calculating feature values that correlate with etching amount, comparing these feature values against reference values, and using the comparison results to control the etching process. This feedback mechanism ensures etching quality while managing system complexity through intelligent control algorithms.
Solution Approach 2:
The patent replaces direct physical measurement of etching amount with optical-based thermographic measurement of temperature distribution. By using a thermographic camera to acquire temperature fields and calculating feature values from these thermal images, the system achieves precise etching quality control without complex mechanical measurement systems.
3Reliability
If temperature distribution acquisition is implemented, then etching defects are prevented, but measurement time increases
Solution Approach 1:
The patent performs preliminary temperature distribution acquisition in the peripheral area before the etching process begins. By acquiring ambient temperature data in advance and calculating feature values beforehand, the system prepares reference information that enables rapid etching quality assessment during the actual process, reducing real-time measurement requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device accurately evaluates and adjusts the etching process to prevent defects by considering both substrate and ambient temperatures, ensuring uniform etching across the substrate surface.
Implementation Method 1
a temperature distribution acquisition unit configured to acquire a temperature distribution in a peripheral area around a substrate area occupied by the substrate
Data Source
AI summary
A substrate holder holds a substrate at a predetermined position. An etching solution supply unit supplies an etching solution to the substrate at the predetermined position. A rotating unit rotates the substrate holder about a predetermined rotation axis. A temperature distribution acquisition unit acquires the temperature distribution in a peripheral area around the substrate area occupied by the substrate when the substrate is arranged at the predetermined position in a chamber. A feature value calculator calculates, from the temperature distribution, a feature value relating an etching amount of the substrate by the etching using the etching solution.