Substrate Processing Apparatus Exhaust Conductance Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing substrate processing techniques face challenges in achieving uniform gas distribution within a processing container, leading to uneven processing due to variations in gas exhaust from slit-shaped exhaust ports, which can be affected by manufacturing errors and thermal expansion, resulting in difficulty in accurately adjusting the opening size of these ports.

Innovation Solution

A substrate processing apparatus with a controller that adjusts the distance between the stage and a facing member to control the conductance between the exhaust port and the processing space, allowing for precise regulation of gas exhaust and improving uniformity by using a lifting mechanism to adjust the position of the stage and cover member relative to the insulating member, thereby optimizing gas distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the opening size of exhaust ports is adjusted to control gas exhaust, then gas distribution uniformity is improved, but manufacturing precision deteriorates due to manufacturing errors and thermal expansion affecting the opening size

Engineering Contradiction:
Improveopening size of exhaust portsVSAvoidgas distribution uniformity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The exhaust port opening size is made dynamically adjustable through a drive mechanism that can change the opening area in real-time. This allows the system to adapt to thermal expansion and manufacturing variations, maintaining reliable gas distribution uniformity despite changes in physical dimensions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system changes the parameter of opening size dynamically rather than relying on fixed manufacturing precision. By using a drive mechanism to adjust the opening area, the system can compensate for thermal expansion and manufacturing errors, ensuring consistent gas exhaust control.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the stage position is fixed, then device complexity is reduced, but gas distribution uniformity deteriorates due to inability to adjust conductance

Engineering Contradiction:
Improvegas distribution uniformityVSAvoidstage positioning mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The stage is equipped with a drive mechanism that enables dynamic position adjustment in the vertical direction. This allows the conductance between the exhaust port and processing space to be optimized, improving gas distribution uniformity while adding controlled complexity to the positioning system.

Inventive Principle:
Principle #15Dynamics

3Ease of operation

If the exhaust port opening size is manually adjusted, then gas exhaust control is simplified, but processing throughput deteriorates due to difficulty in accurate adjustment

Engineering Contradiction:
Improveexhaust controlVSAvoidprocessing throughput
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

The system incorporates feedback control where the drive mechanism adjusts the exhaust port opening size based on monitored gas distribution conditions. This automated feedback loop enables accurate adjustment without manual intervention, maintaining ease of operation while improving processing throughput through precise and rapid control.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

Manual mechanical adjustment of the exhaust port is replaced with an automated drive mechanism. This substitution eliminates the time-consuming and imprecise manual adjustment process, enabling rapid and accurate control that improves processing throughput while maintaining operational simplicity through automation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20230067094A1Substrate processing apparatus
Publication Date: 2023.03.02 TOKYO ELECTRON LTD
  • US20230067094A1 patent drawing
  • US20230067094A1 patent drawing
  • US20230067094A1 patent drawing

AI summary

A substrate processing apparatus including: a processing container; a stage installed in the processing container and configured to place a substrate thereon; a ceiling plate installed at a position facing the stage in the processing container; a driver configured to raise and lower the stage; an exhaust port formed in a side wall of the processing container and configured to exhaust a gas in the processing container; and a controller configured to control conductance of a space between the exhaust port and a processing space between the stage and the ceiling plate by controlling the driver to adjust a distance between a peripheral edge portion of the stage and a facing member disposed at a position facing the peripheral edge portion in the processing container.