Substrate Processing Exhaust Conductance Reduction
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Solution Overview
Problem
In substrate processing, the generation of clearance under a rotary table can cause the first and second reaction gases to mix, leading to unnecessary reactions and contamination of the vacuum container, making independent exhaust of these gases impossible.
Innovation Solution
A substrate processing apparatus with a conductance reduction part that reduces conductance in the vicinity of the first exhaust port, preventing the second process gas from reaching the first exhaust port, and includes a movable rotary table and separate process gas supply regions with corresponding exhaust ports to maintain independent gas exhaust.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the rotary table is moved up to perform a process, then the clearance is generated under the rotary table, but the first and second reaction gases mix and react with each other
Solution Approach 1:
The exhaust system is segmented into separate exhaust paths for the first and second reaction gases, with dedicated exhaust ports positioned at different locations beneath the rotary table. This segmentation prevents gas mixing by providing independent exhaust channels for each reaction gas, allowing the rotary table to be moved up for processing without causing unwanted reactions.
Solution Approach 2:
A partition structure is introduced as an intermediary element between the regions where the first and second reaction gases flow. This partition acts as a physical barrier that prevents the gases from mixing in the clearance space under the rotary table, enabling independent exhaust of each gas while maintaining the movable rotary table configuration.
2Volume of moving object
If the rotary table is moved down to enlarge space, then the clearance is reduced, but the gases cannot be independently exhausted
Solution Approach 1:
The exhaust system is segmented into separate exhaust paths for the first and second reaction gases, with dedicated exhaust ports positioned at different locations beneath the rotary table. This segmentation prevents gas mixing by providing independent exhaust channels for each reaction gas, allowing the rotary table to be moved up for processing without causing unwanted reactions.
Solution Approach 2:
The exhaust ports are positioned at specific local regions beneath the rotary table corresponding to the locations of the first and second reaction gas supply regions. This local positioning ensures that each exhaust port serves its designated gas source independently, maintaining reliable independent exhaust capability even when the rotary table is in the lowered position.
3Reliability
If separate exhaust ports are provided for first and second reaction gases, then independent exhaust is enabled, but the device complexity increases
Solution Approach 1:
The exhaust system merges the evacuation function into the existing vacuum container structure, using the same vacuum pump to maintain vacuum while providing separate exhaust ports for each reaction gas. This approach combines the vacuum maintenance function with the gas exhaust function, enabling independent exhaust capability without proportionally increasing device complexity.
Solution Approach 2:
The vacuum container and vacuum pump serve multiple functions: maintaining the vacuum environment, providing exhaust paths for the first reaction gas, providing exhaust paths for the second reaction gas, and enabling the rotary table to move up and down. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables independent exhaust of the first and second process gases even when a clearance is generated under the rotary table, preventing unnecessary reactions and maintaining the cleanliness of the vacuum container.
Implementation Method 1
a conductance reduction part that reduces conductance in the vicinity of the first exhaust port in a route along which the second process gas flows toward the first exhaust port
Implementation Method 2
the rotary table is often configured to move up and down. When placing a wafer, the rotary table is moved down to enlarge a space. If a warp is settled, the rotary table is moved up to perform a process
Implementation Method 3
a first vacuum exhaust means and a second vacuum exhaust means, respectively, to mutually independently exhaust the interior of the first exhaust path and the interior of the second exhaust path
Data Source
AI summary
A substrate processing apparatus includes: a process chamber; a rotary table provided within the process chamber so as to place a substrate on a surface of the rotary table; a first process gas supply region including a first process gas supply part that supplies a first process gas to the substrate; a second process gas supply region including a second process gas supply part that supplies a second process gas to the substrate; first and second exhaust ports provided below the rotary table; and a conductance reduction part that reduces conductance in the vicinity of the first exhaust port in a route along which the second process gas flows toward the first exhaust port through a communication space, the communication space being generated by upward movement of the rotary table and allowing the first exhaust port and the second exhaust port to communicate with each other.