Substrate Processing Nozzle and Exhaust Port Layout

The exhaust ports are positioned asymmetrically relative to the gas ejection holes, specifically arranged not to face them directly. This asymmetric configuration disrupts direct gas flow paths from the ejection holes to the exhaust ports, preventing the formation of preferential flow channels that would cause non-uniform precursor distribution and film thickness variations across the substrate surface.

The chamber geometry and intermediate space between the gas ejection holes and exhaust ports act as a mediator that redistributes gas flow. By positioning exhaust ports away from direct facing of ejection holes, the gas flow must traverse through intermediate regions of the chamber, allowing for more uniform dispersion of precursor gases before reaching the substrate and improving in-plane film thickness uniformity.

Each nozzle in the system is designed to perform multiple functions: supplying precursor or reactant gases while also contributing to the overall gas flow distribution pattern. The exhaust ports serve dual purposes of removing reaction byproducts and regulating chamber pressure. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity despite the use of multiple nozzles.

The gas supply system is segmented into multiple nozzles positioned at different locations and angles, with each nozzle responsible for a specific region or function. This segmentation allows for precise control of gas distribution across the substrate surface, improving film thickness uniformity while maintaining manageable system complexity through modular design.