Substrate Processing Exhaust Layout for Chamber Pressure Stability

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Solution Overview

Problem

The challenge in semiconductor manufacturing is maintaining stable internal pressure during the developing process in a substrate processing apparatus, particularly when the puddle step is conducted in one process chamber and the substrate loading step is conducted in an adjacent chamber, leading to exhaust interference that causes shaking of the developing liquid on the substrate, resulting in process defects.

Innovation Solution

An apparatus with an integrated exhaust line and an interference alleviation unit that includes a discharge unit to divert air flow from one process chamber to the atmosphere, thereby maintaining internal pressure and reducing exhaust interference between adjacent chambers during substrate loading and puddle steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrate loading is performed in the second process chamber, then substrate processing efficiency is improved, but exhaust interference increases causing internal pressure instability in the first process chamber

Engineering Contradiction:
Improvesubstrate processing efficiencyVSAvoidinternal pressure stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The exhaust system is segmented into multiple independent exhaust lines (first exhaust line for first process chamber, second exhaust line for second process chamber) that connect to different points on the integrated exhaust line, allowing independent exhaust control for each chamber to prevent pressure interference

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A pressure reduction unit is introduced as an intermediary component on the integrated exhaust line to regulate and reduce exhaust pressure, preventing pressure fluctuations from propagating between adjacent process chambers and maintaining stable internal pressure

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If exhaust amount is increased in the second process chamber during substrate loading, then exhaust efficiency is improved, but air flow disruption increases causing process defects in the first process chamber

Engineering Contradiction:
Improveexhaust efficiencyVSAvoidprocess quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The exhaust system uses separate exhaust lines for each process chamber that connect to different locations on the integrated exhaust line, enabling independent exhaust flow control that allows high exhaust efficiency in one chamber without disrupting processes in adjacent chambers

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the exhaust system are optimized for different functions: the first and second exhaust lines provide localized exhaust control for their respective chambers, while the pressure reduction unit provides localized pressure regulation on the integrated exhaust line to prevent air flow disruptions that would cause process defects

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively maintains internal pressure during the developing process, alleviating exhaust interference and preventing process defects by controlling air flow through the integrated exhaust line and discharge unit, ensuring stable substrate treatment.

Implementation Method 1

an integrated exhaust line in which a pressure reduction unit is installed

Methodology Applied
Scientific EffectPressure reduction: Depressurisation

Implementation Method 2

a discharge unit configured to discharge some air flow in the integrated exhaust line to the outside of the integrated exhaust line

Methodology Applied
Scientific EffectAir flow diversion: Convection

Data Source

PatentUS12529960B2Apparatus for treating substrate including interference alleviation unit
Publication Date: 2026.01.20 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12529960B2 patent drawing
  • US12529960B2 patent drawing
  • US12529960B2 patent drawing

AI summary

Provided is an apparatus for treating a substrate. The apparatus for treating the substrate includes: a first process chamber having a first treating space therein; a second process chamber having a second treating space therein; and an exhaust unit configured to exhaust atmospheres of the first treating space and the second treating space, in which the exhaust unit includes an integrated exhaust line in which a pressure reduction unit is installed, a first exhaust line configured to connect the first process chamber and a first point of the integrated exhaust line, a second exhaust line configured to connect the first process chamber and a second point of the integrated exhaust line, and an interference alleviation unit configured to alleviate exhaust interference between the first process chamber and the second process chamber.