Substrate Processing Apparatus Exothermic Edge Etching
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Solution Overview
Problem
Existing substrate processing technologies face challenges in efficiently improving the etching process at the peripheral edge portions of substrates, particularly in a simplified configuration.
Innovation Solution
A substrate processing apparatus and method that includes a rotary holding part for rotating the substrate, a first supply part for etching solution on the upper surface, a second supply part for etching solution on the lower surface, and a third supply part for a second chemical solution that exothermically reacts with the first solution on the lower surface, enhancing the etching process by heating the peripheral edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a first processing solution nozzle supplies a first processing solution to a peripheral edge portion of the substrate, then the etching process at the peripheral edge portion is improved, but the device complexity increases due to additional heating components
Solution Approach 1:
The patent combines the heating function and processing solution supply function into a single integrated nozzle structure. The first processing solution nozzle includes both a processing solution supply port and a heating port, allowing simultaneous delivery of chemical etching solution and thermal energy through the same component, thereby improving etching rate while avoiding additional separate heating components
Solution Approach 2:
The first processing solution nozzle is designed with multi-functionality, serving both as a chemical supply device and a heating device. By incorporating both processing solution supply and heating capabilities into one nozzle, the system achieves enhanced etching performance without increasing the number of separate components, thus resolving the contradiction between productivity improvement and device complexity
2Productivity
If a first processing solution nozzle supplies a first processing solution to a peripheral edge portion of the substrate, then the etching process at the peripheral edge portion is improved, but the ease of operation decreases due to additional control parameters
Solution Approach 1:
By merging the heating function and processing solution supply into a single nozzle controlled by one supply unit, the system reduces the number of independent control parameters. The integrated design allows coordinated delivery of heat and chemical etching agent through unified control, simplifying operational procedures while maintaining enhanced etching performance
3Productivity
If heating is applied to the peripheral edge portion of the substrate, then the etching speed is improved, but the loss of energy increases due to additional heating requirements
Solution Approach 1:
The integration of heating and processing solution supply in a single nozzle enables direct coupling of thermal energy and chemical etching at the substrate surface. This combined approach allows the heating energy to immediately facilitate the etching reaction without separate energy input requirements, improving etching speed while optimizing energy utilization efficiency
Solution Approach 2:
The continuous simultaneous supply of heating and processing solution through the integrated nozzle ensures that the peripheral edge portion of the substrate continuously receives both thermal energy and chemical etching agent. This continuous dual-action approach maintains high etching speed throughout the process while avoiding intermittent energy input and associated energy losses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the etching speed at the peripheral edge by heating the area through the reaction of the chemical solutions, while maintaining a simplified structure and allowing for adjustable ratios based on the substrate type, thereby enhancing processing efficiency.
Implementation Method 1
a third supply part configured to supply a second chemical solution, which exothermically reacts with the first chemical solution, to the peripheral edge portion of the lower surface of the substrate
Data Source
AI summary
There is provided a substrate processing apparatus including a rotary holding part configured to hold and rotate a substrate with a film formed on an upper surface of the substrate; a first supply part configured to supply a first chemical solution for etching the film to a peripheral edge portion of the upper surface of the substrate held by the rotary holding part; a second supply part configured to supply the first chemical solution to a peripheral edge portion of a lower surface of the substrate; and a third supply part configured to supply a second chemical solution, which exothermically reacts with the first chemical solution, to the peripheral edge portion of the lower surface of the substrate.