Substrate Exposure Correction for Accurate Bonded Alignment
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Solution Overview
Problem
Substrates fail to bond accurately during the bonding process due to positioning issues, leading to potential mismatches and defects such as open or short circuits.
Innovation Solution
A substrate processing system that includes a measuring apparatus to measure substrate distortions and alignment marks, a computation apparatus to determine exposure conditions based on measured data, and an exposure apparatus to correct exposure patterns, ensuring precise alignment and bonding of substrates by adjusting exposure patterns using post-correction techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrates are bonded without exposure pattern correction, then the bonding process is simple and fast, but positioning accuracy deteriorates leading to mismatches and defects
Solution Approach 1:
The exposure pattern is corrected in advance based on measured substrate distortion information before the bonding process. The computation apparatus calculates correction amounts from distortion data obtained by the measurement apparatus, and the exposure apparatus applies these corrections to align patterns on the second substrate with corresponding patterns on the first substrate, ensuring accurate positioning prior to bonding.
Solution Approach 2:
The system employs a feedback loop where the measurement apparatus measures actual substrate distortion, the computation apparatus processes this information to determine correction amounts, and the exposure apparatus applies the corrections. This closed-loop feedback mechanism ensures that positioning accuracy is continuously optimized based on actual substrate conditions.
2Reliability
If exposure patterns are corrected based on measured substrate distortions, then bonding accuracy is improved, but measurement and computation processes are added increasing system complexity
Solution Approach 1:
The computation apparatus serves as an intermediary that bridges the measurement apparatus and the exposure apparatus. It receives distortion information from the measurement apparatus, calculates the necessary correction amounts, and transmits these corrections to the exposure apparatus. This intermediary component coordinates the information flow and processing between measurement and exposure operations, enabling accurate bonding while managing system complexity through modular architecture.
3Productivity
If substrates are positioned without distortion measurement, then the process is faster and simpler, but positioning errors occur leading to bonding failures
Solution Approach 1:
Substrate distortion measurement and exposure pattern correction are performed in advance before the bonding process. By obtaining distortion information and applying corrections prior to bonding, the system ensures that positioning accuracy is established beforehand, allowing the actual bonding operation to proceed quickly without requiring complex real-time adjustments.
Solution Approach 2:
The measurement apparatus provides feedback on actual substrate distortion conditions, enabling the system to adjust exposure patterns accordingly. This feedback mechanism ensures that positioning precision is optimized based on real substrate characteristics while maintaining efficient processing throughput.
Data Source
AI summary
A substrate processing system includes a substrate information acquiring unit configured to acquire substrate information including position information of a structure which is formed on a first substrate and a determination unit configured to determine an exposure condition for exposing a second substrate which is bonded to the first substrate to light on the basis of the acquired substrate information.