Substrate Exposure via Mask Segmentation and Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing production processes for color filter substrates require new masks for larger substrate sizes, leading to high production costs due to the need for replacing production lines.
Innovation Solution
A method and system that expose and develop substrates by dividing them into regions, aligning substrate alignment marks with mask alignment marks, and adjusting the substrate or mask to correct inclination angles, allowing for exposure with a smaller mask to cover larger areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mask the same size as the substrate is used for exposure, then the entire substrate can be exposed in one operation, but the production cost increases due to the need for larger masks and replacement of production lines
Solution Approach 1:
The substrate surface is divided into multiple regions, each region being exposed separately using a smaller mask. The exposure process is segmented into multiple operations, where the mask exposes one region at a time, and the substrate is repositioned between exposures to cover the entire substrate area.
Solution Approach 2:
The system introduces dynamic repositioning of either the mask or the substrate between exposure operations. The mask or substrate is moved to different positions and orientations to expose different regions, transforming a static single-exposure process into a dynamic multi-exposure process that uses a smaller mask.
2Ease of manufacture
If multiple exposures are performed with a smaller mask, then production cost decreases, but alignment precision becomes more difficult to maintain across different regions
Solution Approach 1:
Alignment marks are pre-formed on the substrate before the exposure process begins. These marks serve as reference points that are detected before each exposure operation, allowing the system to calculate and correct positioning deviations in advance, ensuring precise alignment across multiple exposure regions.
Solution Approach 2:
The system implements a feedback mechanism where alignment marks are detected and used to calculate the actual position and orientation of the substrate. This information is fed back to the positioning system, which automatically adjusts the mask or substrate position to correct any deviations, ensuring consistent alignment precision across all exposure regions.
3Ease of manufacture
If the substrate is repositioned for each region exposure, then a smaller mask can be used, but the exposure time increases due to multiple operations
Solution Approach 1:
The exposure process is designed to minimize idle time between regions by maintaining continuous useful action. The mask or substrate is repositioned efficiently between exposures, and the exposure operations are sequenced to maximize productivity, reducing the total time loss associated with multiple exposure operations.
Data Source
AI summary
The present disclosure provides a method for exposure and development, a system for controlling exposure and a system for exposure and development. The method for exposure and development is configured to expose and develop a substrate when the substrate having a size larger than that of a mask. The method includes: exposing and developing a plurality of different regions of the substrate by means of the mask respectively, wherein the plurality of different regions are pieced to form an entire region which needs to be exposed and developed.