Substrate Fastening Structure for High-Temperature Reflow Assembly
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Solution Overview
Problem
The challenge of stably combining and fastening electronic devices with heat dissipation base plates in a limited space, while withstanding high-temperature processes like reflow soldering, is exacerbated by the limited area for fastening due to dense circuit board components and the potential for solder paste re-melting to affect electrical performance.
Innovation Solution
A substrate-fastening device with a hook-shaped structure and fixation resin forms a buckle to securely attach a substrate to a base, ensuring stability during high-temperature processes by using a metal material with high mechanical strength and a resin with good adhesion and temperature resistance, allowing for automated assembly and multiple reflow soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws made of high temperature resistant metal materials are used to fasten the circuit board and heat dissipation base plate, then electrical safety is maintained, but the required fastening area increases which is not available due to dense component layout
Solution Approach 1:
The fastening function is segmented into two parts: a metal hook-shaped structure for mechanical support and positioning, and fixation resin for bonding. This segmentation allows the metal portion to be small and precise while the resin provides the bonding function, reducing the overall fastening area requirement while maintaining electrical safety through the metal material.
Solution Approach 2:
The hook-shaped metal structure is embedded within the fixation resin, creating a nested configuration where the metal hook provides structural support and the resin provides bonding. This nested arrangement maximizes the use of limited space while maintaining both mechanical strength and electrical safety.
2Ease of manufacture
If welding is used to fasten the circuit board and heat dissipation base plate, then assembly is simplified, but solder paste re-melts during high temperature reflow soldering affecting electrical performance
Solution Approach 1:
The fastening device uses composite materials combining metal (for high temperature resistance and mechanical strength) and fixation resin (for bonding). This composite structure maintains integrity during high temperature reflow soldering processes, preventing solder paste re-melting issues while ensuring reliable electrical performance.
3Temperature
If solder paste with high melting point is used to withstand high temperature reflow soldering, then temperature resistance is improved, but cracks form on the solder paste after re-soldering
Solution Approach 1:
The hook-shaped metal structure and fixation resin provide prior mechanical support and bonding before the reflow soldering process. This pre-support cushioning prevents excessive stress on the solder paste during high temperature processing, avoiding crack formation while maintaining temperature resistance.
4Strength
If a hook-shaped metal structure is used for fastening, then mechanical strength is high and space occupied is small, but additional fastening measures are needed to prevent disassembly during high temperature processes
Solution Approach 1:
The hook-shaped metal structure is merged with the fixation resin to form an integrated fastening system. The metal hook provides mechanical strength and positioning, while the resin provides bonding and prevents disassembly. This combination maintains small space occupation while ensuring reliability during high temperature processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable, integrated substrate-assembling structure that withstands multiple reflow soldering processes, enhances manufacturing flexibility, simplifies assembly, and reduces product costs while improving competitiveness.
Implementation Method 1
Since the fixation resin has the features of good adhesion, strong tensile and compressive strength, and good resistance at high temperature and low temperature
Data Source
AI summary
A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.