Substrate Processing Management System Fault Point Estimation
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Solution Overview
Problem
The existing substrate inspection systems have a high misreporting rate due to strict determination criteria, leading to erroneous defect determinations, especially when component manufacturers or lots change, making it difficult to identify fault points and implement countermeasures in substrate processing lines.
Innovation Solution
A substrate processing management system that includes a defect tallying section, attribute change recognition section, fault point estimation section, and countermeasure calling section to automatically estimate fault points and suggest countermeasures when the defect rate exceeds a predetermined value, distinguishing between issues in the substrate inspection machine and component mounting machine based on attribute changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If strict determination criteria are used in the substrate inspection machine to achieve fail-safe condition, then the reliability of defect detection is improved, but the misreporting rate increases leading to erroneous defect determinations
Solution Approach 1:
The determination criteria are made dynamic by adjusting them based on component attribute information. When component attributes change (manufacturer, lot, shape, color), the inspection criteria are automatically updated to match the new component characteristics, transforming the static strict criteria into adaptive dynamic criteria that maintain high reliability while reducing false positives.
Solution Approach 2:
The inspection parameters such as shape, color, and other attributes are changed according to the component information. By modifying the determination criteria parameters to match the actual component being inspected, the system maintains strict quality control while avoiding erroneous determinations caused by using outdated or incorrect reference parameters.
2Adaptability or versatility
If component manufacturer or lot is switched, then the adaptability of the inspection system is improved, but the misreporting rate increases due to changes in component shape and color
Solution Approach 1:
The system performs preliminary actions by acquiring component attribute information (shape, color, manufacturer, lot) before the inspection process begins. This advance preparation allows the inspection criteria to be pre-adjusted to match the incoming component characteristics, ensuring accurate inspection from the start and preventing misreporting when component attributes change.
Solution Approach 2:
The system implements feedback by continuously monitoring component attribute information and using this feedback to adjust the determination criteria. When component manufacturer or lot changes are detected, the feedback mechanism triggers automatic updates to the inspection parameters, maintaining measurement precision across different component variations.
3Device complexity
If information on component attributes is not shared among substrate processing machines, then the device complexity is reduced, but the ability to estimate fault points and implement countermeasures deteriorates
Solution Approach 1:
The substrate inspection machine is given universal functionality by enabling it to not only inspect substrates but also to acquire, store, and manage component attribute information that can be used for fault analysis. This multi-functionality allows the machine to serve multiple purposes without adding separate dedicated systems, maintaining relatively low complexity while improving fault identification capability.
Data Source
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AI summary
The substrate processing management system for a substrate processing line including a component mounting machine configured to mount electronic components on a substrate and a substrate inspection machine configured to inspect the mounting state of electronic components mounted on a substrate to determine whether each of the substrates or each of the electronic components is defective, comprises: a defect tallying section configured to calculate a defect rate representing a rate of occurrence of substrates or electronic components determined to be defective with the substrate inspection machine, or obtain a number of defective products having substrates or electronic components determined to be defective; an attribute change recognition section configured to recognize when an attribute, among the attributes of the electronic component, having a possibility of affecting the inspection, has changed in the component mounting machine; a fault point estimation section configured to estimate, when the defect rate or the number of defective products exceeds a predetermined value, which of the component mounting machine or the substrate inspection machine is a fault point depending on whether an attribute has changed; and a countermeasure calling section configured to call for a defect countermeasure to the estimated fault point.