Substrate Recess Fill Inspection Using Integrated Absorbance Spectra
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Solution Overview
Problem
Existing technologies face challenges in detecting embedding defects, such as voids, in recesses of miniaturized patterns on substrates during film formation processes.
Innovation Solution
A determination method involving spectroscopic measurement to analyze the absorbance spectrum of substrates with embedded materials, using an integrated value of intensity at multiple wavenumbers to determine the embedded state of recesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spectroscopic measurement is performed on miniaturized patterns with recesses, then embedding defects can be detected, but measurement precision is reduced due to the small size and complex structure of the patterns
Solution Approach 1:
The patent transforms the measurement approach from direct spatial observation of miniaturized patterns to spectral domain analysis. By converting physical structure information into absorbance spectrum data across multiple wavenumbers, the measurement shifts from one spatial dimension to spectral dimensions, enabling reliable defect detection despite the small physical size of the patterns.
Solution Approach 2:
The patent changes the measurement parameters by integrating absorbance intensity across multiple wavenumbers rather than relying on single-wavelength measurements. This parameter transformation from spatial/intensity domain to spectral integrated value domain enhances the signal-to-noise ratio and improves measurement precision for miniaturized structures.
2Ease of manufacture
If traditional inspection methods are used for recess filling, then manufacturing process is simple, but embedding defects such as voids cannot be reliably detected
Solution Approach 1:
The patent replaces traditional mechanical or optical inspection methods with spectroscopic measurement. Instead of using physical probes or simple optical microscopy to inspect recess filling, the system uses absorbance spectroscopy to detect embedding defects, achieving reliable void detection while maintaining ease of manufacture through non-contact measurement.
Solution Approach 2:
The patent introduces absorbance spectrum as an intermediary between the physical structure of recesses and the detection system. Rather than directly observing the recesses, the method uses spectral absorption characteristics as a mediator to reveal embedding defects, combining measurement simplicity with high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the detection of embedding defects, such as voids, by accurately assessing the embedded state of recesses, thereby improving the quality control of film formation processes.
Implementation Method 1
measuring the absorbance spectrum of the substrate having the embedding material embedded therein
Data Source
AI summary
There is provided a determination method comprising: a post-embedding measurement step for performing spectroscopic measurement on a substrate in which a pattern including a recess is formed, the recess having an embedding material embedded therein, and measuring an absorbance spectrum of the substrate having the embedding material embedded therein; and a determination step for determining an embedded state of the recess based on an integrated value of an intensity of the measured absorbance spectrum of the substrate at a plurality of wavenumbers.