Substrate Pattern Filling Composition for Collapse-Free Cleaning

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Solution Overview

Problem

Current methods for cleaning fine substrate patterns face challenges such as pattern collapse, incomplete cleaning, difficulty in film formation and removal, low solubility of solid components, and complexity in the removal process, leading to poor yield and stability issues.

Innovation Solution

A substrate pattern filling composition comprising a first solute with an amino, hydroxy, or carbonyl group, a second solute with similar functional groups, and a solvent, where the boiling points and vapor pressures are carefully controlled to allow for stepwise vaporization and efficient film removal without heating or pressure reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cleaning liquid such as deionized water or organic solvent is supplied to remove contaminants, then cleaning effect is improved, but pattern collapse occurs due to surface tension and capillary action during drying

Engineering Contradiction:

Improvecleaning effectVSAvoidpattern collapse

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent utilizes the phase transition of the solute from solid to gas (sublimation) to remove the filling material. By controlling the sublimation temperature to be lower than the decomposition temperature of the resist pattern, the filling material can be removed without causing pattern collapse. This phase transition approach allows effective cleaning while avoiding the harmful effects of surface tension and capillary action associated with liquid cleaning methods.

Inventive Principle:

Principle #36Phase transitions

2Object-affected harmful factors

If a sublimable substance is used as filling treatment agent, then pattern collapse is prevented, but complete cleaning of the substrate pattern is difficult to achieve

Engineering Contradiction:

Improvepattern collapse preventionVSAvoidcleaning completeness

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent optimizes several parameters to achieve both pattern collapse prevention and complete cleaning: (1) selecting a solute with appropriate sublimation temperature (lower than resist decomposition temperature), (2) controlling the concentration of solute in the filling material (1-40 mass%), (3) adjusting the viscosity of the filling material (10-10,000 cP), and (4) controlling the film thickness (1-100 nm). These parameter changes enable complete cleaning while maintaining pattern integrity.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If heating and pressure reduction are applied to remove the film, then film removal is achieved, but process complexity and energy consumption increase

Engineering Contradiction:

Improvefilm removalVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical/thermal system (heating and pressure reduction equipment) with a chemical/sublimation-based system. The filling material is designed to sublime at temperatures below the decomposition temperature of the resist pattern, allowing film removal through simple heating without requiring complex pressure reduction equipment. This substitution simplifies the overall process while maintaining effective film removal capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Productivity

If solubility of solid component in solvent is increased, then filling efficiency is improved, but composition stability decreases

Engineering Contradiction:

Improvefilling efficiencyVSAvoidcomposition stability

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by having different components serve different functions: the solvent provides high solubility for the solute (1-40 mass%) to ensure good filling efficiency, while the solute itself provides composition stability through its low volatility and controlled sublimation properties. The specific combination of solute and solvent creates a balanced system where each component compensates for the other's limitations, achieving both high filling efficiency and composition stability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively prevents pattern collapse, ensures complete cleaning, facilitates film formation and removal, improves solubility, reduces the complexity of the removal process, and enhances the stability and yield of the cleaning process.

Implementation Method 1

vaporizing the film to remove it... vaporizing the solvent first and then vaporizing the solute stepwise

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

replacing the cleaning liquid with a filling treatment agent containing a sublimable substance and sublimating the sublimable substance

Methodology Applied

Scientific EffectSublimation: Sublimation

Data Source

PatentUS11859152B2Substrate pattern filling composition and use of the same

Publication Date: 2024.01.02 MERCK PATENT GMBH

AI summary

To provide a substrate pattern filling composition capable of suppressing pattern collapse and a method for using the same. A substrate pattern filling composition comprising a first solute (A), a second a solute (B) and a solvent (C), and a method for using the same.