Substrate Film Deposition Sequence for 3D Step Coverage
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Solution Overview
Problem
Existing methods face challenges in achieving optimal step coverage of films formed on substrates with complex three-dimensional structures, such as trenches and grooves, during semiconductor device manufacturing.
Innovation Solution
A method involving a cycle of supplying an inhibitor, a first precursor, a second precursor, and a reactant to the substrate, with each step optimized to enhance film formation on both the surface and inner recesses of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional film formation process is used, then the film can be formed on the substrate surface, but the step coverage on complex three-dimensional structures (trenches and grooves) is insufficient
Solution Approach 1:
The film formation process is segmented into multiple sequential steps: inhibitor supply step, first precursor supply step, second precursor supply step, and reactant supply step. Each step targets different regions of the substrate structure, with the inhibitor preferentially adsorbing on horizontal surfaces and the precursors filling vertical trenches and grooves, thereby achieving uniform step coverage on complex three-dimensional structures
Solution Approach 2:
The inhibitor is supplied in advance before the precursors to pre-adsorb on the substrate surface, particularly on horizontal surfaces. This preliminary action prevents unwanted precursor adsorption on horizontal surfaces while allowing precursors to penetrate and adsorb on vertical sidewalls of trenches and grooves, improving step coverage before the actual film formation begins
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the step coverage of films on substrates with complex structures by preferentially adsorbing and forming layers on both the surface and inner recesses, enhancing the manufacturing process efficiency.
Implementation Method 1
an inhibitor is supplied to a substrate; a first precursor is supplied from a first reservoir to the substrate
Implementation Method 2
a first precursor is supplied from a first reservoir to the substrate; a second precursor is supplied from a second reservoir to the substrate
Implementation Method 3
a reactant is supplied to the substrate
Data Source
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AI summary
There is provided a technique that includes forming a film on a substrate (200) by performing a cycle a predetermined number of times, the cycle including: (a) supplying an inhibitor to the substrate (200); (b) supplying a first precursor from a first reservoir (240a) to the substrate (200); (c) supplying a second precursor from a second reservoir (240b) to the substrate (200); and (d) supplying a reactant to the substrate (200).