Substrate Film Deposition with Regulated Adsorption Control
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Solution Overview
Problem
Existing substrate processing methods for semiconductor devices face challenges in improving the characteristics of films formed on substrates, particularly in controlling the adsorption of precursor and reactant molecules, which affects film quality and efficiency.
Innovation Solution
A method involving the sequential and overlapping supply of a precursor, reactant, and a regulating agent to the substrate, with precise control of exposure amounts and conditions to manage adsorption, including the use of halogen-containing agents and alkyl groups to inhibit precursor adsorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a precursor and reactant are supplied to a substrate to form a film, then film formation is achieved, but the characteristics of the formed film are insufficient
Solution Approach 1:
The film formation process is divided into multiple discrete steps: precursor supply, regulating agent supply, reactant supply, and overlapping supply phases. This segmentation allows precise control of each stage to optimize both film characteristics and formation efficiency
Solution Approach 2:
The regulating agent is supplied before the reactant to pre-regulate the adsorption state of the substrate surface. This preliminary action controls the amount of precursor and reactant that will be adsorbed, ensuring optimal film characteristics from the outset
Solution Approach 3:
The method dynamically adjusts the supply timing and overlap of precursor, regulating agent, and reactant. By controlling the overlapping periods where multiple gases are supplied simultaneously, the process adapts to achieve desired film properties while maintaining efficiency
2Manufacturing precision
If the amount of precursor and reactant adsorbed on the substrate is increased to improve film quality, then film characteristics improve, but adsorption control becomes difficult
Solution Approach 1:
A regulating agent is introduced as an intermediary substance that mediates between the precursor/reactant and the substrate surface. This agent controls the adsorption process by regulating the amount of precursor and reactant that can be adsorbed, simplifying the control mechanism while improving film quality
Solution Approach 2:
The method changes the chemical environment by introducing the regulating agent, which alters the adsorption parameters of the substrate surface. This parameter change enables precise control over the amount of precursor and reactant adsorbed, directly impacting film quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances film formation by regulating adsorption, leading to improved film quality and efficiency in semiconductor device manufacturing.
Implementation Method 1
supplying a regulating agent, which regulates an amount of at least one selected from the group of a molecule of the precursor and a molecule of the reactant adsorbed on the substrate, to the substrate
Data Source
AI summary
There is provided a technique that includes: (a) supplying a precursor to a substrate; (b) supplying a reactant to the substrate; (c) supplying a regulating agent, which regulates an amount of at least one selected from the group of a molecule of the precursor and a molecule of the reactant adsorbed on the substrate, to the substrate; (d) performing a process in which at least one selected from the group of (a) and (b) overlaps (c); and (e) after (d), performing (a) or (b) which overlaps (c) in (d), independently of (c).