Substrate Processing Film Etching With Lower Chemical Consumption
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Solution Overview
Problem
Existing substrate etching processes result in significant environmental load due to the large quantities of etching and rinse liquids used, necessitating a reduction in the consumption of these components.
Innovation Solution
A method involving a processing film forming step to solidify a processing liquid on the substrate, followed by etching component formation, etching, and peeling to minimize etching component consumption, along with a peeling liquid to detach and remove the processing film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If an etching liquid is continuously supplied to the front surface of the substrate to etch the surface layer portion, then the etching process can be performed, but the etching component is expelled one after another to the outside of the substrate, resulting in large consumption of etching components and environmental load
Solution Approach 1:
The etching component is pre-formed within the processing film before the etching process begins. This preliminary formation allows the etching component to remain confined within the film structure, preventing premature expulsion and reducing overall consumption while maintaining effective etching action on the substrate surface.
Solution Approach 2:
The processing film acts as an intermediary medium that contains and controls the etching component. Instead of directly supplying etching liquid to the substrate, the etching component is first embedded in the processing film, which then mediates the etching action, reducing direct contact and expulsion of etching components.
2Loss of substance
If a processing film is formed on the substrate and etching component forming processing is performed, then etching component consumption is reduced, but the process complexity increases with multiple steps including film formation, etching component formation, and film removal
Solution Approach 1:
Multiple functions are merged into the processing film: it serves as the substrate for etching component formation, contains the etching component during the etching process, and acts as a removable carrier for taking away etching residues. This merging reduces the need for separate process steps and equipment.
Solution Approach 2:
The processing film performs multiple functions simultaneously: it is the medium for etching component formation, the container for etching component delivery, and the carrier for residue removal. This multi-functionality simplifies the overall process architecture despite the multi-step nature of the treatment.
3Ease of manufacture
If the processing film is removed by dissolving in peeling liquid, then the film can be removed, but etching residues may remain on the substrate surface
Solution Approach 1:
The etching residues are extracted from the substrate surface by being incorporated into the processing film during the etching process. When the film is subsequently removed, the residues are taken out together with the film, ensuring complete surface cleaning without leaving behind any etching byproducts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the amount of etching components consumed by forming and reacting them within the processing film, allowing for efficient etching and removal of surface layer portions while minimizing environmental impact.
Implementation Method 1
a processing liquid is supplied to a front surface of a substrate to solidify or cure the processing liquid on the front surface of the substrate, thereby forming a processing film
Implementation Method 2
the processing film which is formed on the substrate is subjected to the etching component forming processing such as heating, light irradiation, and supply of water
Implementation Method 3
the processing film which is formed on the substrate is subjected to the etching component forming processing such as heating, light irradiation, and supply of water
Implementation Method 4
a peeling liquid is supplied to a front surface of the processing film, thereby peeling the processing film from the front surface of the substrate and removing the processing film
Data Source
AI summary
A substrate processing method includes a processing film forming step in which a processing liquid is supplied to a front surface of a substrate to solidify or cure the processing liquid on the front surface of the substrate, thereby forming a processing film on the front surface of the substrate, an etching component forming step in which the processing film is subjected to etching component forming processing to form an etching component in the processing film, an etching step in which a surface layer portion of the substrate is etched by the etching component formed in the etching component forming step, and a processing film removing step in which a peeling liquid is supplied to a front surface of the processing film, thereby peeling the processing film from the front surface of the substrate and removing the processing film from the front surface of the substrate.