Substrate Chemical Film Control for Particle-Resistant Processing
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Solution Overview
Problem
Existing substrate processing methods struggle to effectively reduce particles, particularly small-sized particles, generated from control valves in the flow rate adjustment of processing liquids, which adhere to substrates during chemical liquid processing.
Innovation Solution
A method involving a pre-wet step with a clean liquid at a high flow rate, followed by a chemical liquid processing with varying flow rates and rotation speeds to form thick liquid films that prevent particle adhesion, while minimizing chemical liquid consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a control valve is used to adjust the flow rate of processing liquid, then the flow rate can be controlled, but particles are generated from the control valve and contaminate the substrate
Solution Approach 1:
The patent extracts and removes the control valve from the liquid path that contacts the substrate. Instead of placing a control valve in the branch line, the system uses a control valve in the main line upstream, and employs flow restrictors (orifices) in the branch lines to achieve flow rate control without particles generated from valves in the substrate-contacting path.
Solution Approach 2:
The patent introduces flow restrictors (orifices) as intermediary components in the branch lines. These passive flow restriction elements control the flow rate to the substrate without the mechanical moving parts that generate particles, serving as a clean intermediary between the controlled flow from the main line and the substrate processing.
2Object-affected harmful factors
If the flow rate of chemical liquid is increased to form a thick liquid film, then particle adhesion is prevented, but chemical liquid consumption increases
Solution Approach 1:
The patent applies a pre-wet liquid to the substrate before applying the chemical liquid. This preliminary action creates a base liquid film that provides particle protection, allowing the subsequent chemical liquid to be applied at lower flow rates while maintaining adequate protective film thickness and reducing overall chemical liquid consumption.
Solution Approach 2:
The patent uses a pre-wet liquid in excess to ensure complete substrate coverage and form a robust base liquid film. This partial application of excessive liquid (the pre-wet liquid) protects the substrate during the subsequent chemical liquid processing, enabling reduced chemical liquid flow rates while maintaining particle protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces particle adhesion on substrates by forming protective liquid films and optimizing flow rates, effectively minimizing particle contamination while reducing chemical liquid usage.
Implementation Method 1
supplying a pre-wet liquid to a substrate while the substrate is being rotated, and forming a liquid film of the pre-wet liquid on a surface of the substrate
Implementation Method 2
supplying a chemical liquid to the substrate at a first flow rate while the substrate is being rotated at a first rotation speed, and performing a first chemical liquid processing on the substrate with the chemical liquid to form a liquid film of the chemical liquid having a first thickness on the surface of the substrate
Data Source
AI summary
A substrate processing method includes: supplying a pre-wet liquid to a substrate while rotating the substrate, and forming a liquid film of the pre-wet liquid on a surface of the substrate; supplying a chemical liquid at a first flow rate to the substrate while the substrate is being rotated at a first rotation speed, and processing the substrate with the chemical liquid to form a liquid film of the chemical liquid having a first thickness on the surface of the substrate; and supplying the chemical liquid to the substrate at a second supply flow rate while the substrate is being rotated at a second rotation speed, and performing a second chemical liquid processing on the substrate with the chemical liquid to form a liquid film of the chemical liquid having a second thickness on the surface of the substrate.