Substrate Cleaning Film Peeling With In-Situ Dissolving Liquid
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Solution Overview
Problem
Existing substrate cleaning methods struggle to efficiently remove contaminants while preserving fine and complex uneven patterns without increasing costs due to the use of expensive peeling liquids.
Innovation Solution
A method involving a dissolving and peeling liquid forming liquid that spontaneously forms on the substrate, peels the processing film while holding the object to be removed, reducing the need for large amounts of expensive peeling liquid by forming a penetrating hole and using less expensive liquids like pure water.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a peeling liquid is supplied to peel the processing film from the substrate, then the processing film can be removed in the state where the object to be removed is held, but the peeling liquid is consumed in large amount and cost increases
Solution Approach 1:
The processing film itself serves as the source of peeling liquid by containing a peeling liquid-forming substance that dissolves upon contact with the substrate or processing environment, eliminating the need for external peeling liquid supply and reducing consumption
Solution Approach 2:
The processing film performs multiple functions: it holds the object to be removed, provides protection during processing, and serves as a source of peeling liquid for film removal, combining several functions into a single component
2Productivity
If the processing film is dissolved on the substrate, then the object to be removed can be removed together with dissolved matter, but the object to be removed may fall off and become reattached to the substrate
Solution Approach 1:
The processing film is designed to maintain its structural integrity and holding capability until the precise moment of removal, ensuring the object to be removed remains securely held during the dissolution process and does not fall off or reattach
Solution Approach 2:
The film's solubility parameters are carefully controlled so that the film dissolves at the appropriate time and rate, allowing complete removal of the object to be removed without premature dissolution that would cause falling off or reattachment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient removal of contaminants from the substrate surface is achieved while minimizing cost by using less expensive liquids and reducing the consumption of expensive peeling liquids, thus maintaining cost-effectiveness.
Implementation Method 1
a dissolving and peeling liquid forming liquid is supplied to a surface of a substrate to put the dissolving and peeling liquid forming liquid in contact with a processing film and dissolve the dissolving and peeling liquid forming substance in a solid state inside the processing film
Implementation Method 2
a processing liquid, containing a solute and a solvent having volatility, is supplied to an upper surface of a substrate, the processing liquid is solidified or cured to form a processing film
Data Source
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AI summary
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a surface of a substrate, a processing film forming step of solidifying or curing the processing liquid supplied to the surface of the substrate to form, on the surface of the substrate, a processing film that holds a removal object present on the surface of the substrate, a peeling step of supplying a peeling liquid forming liquid to the surface of the substrate to put the peeling liquid forming liquid in contact with the processing film and form a peeling liquid, and peeling the processing film, in the state of holding the removal object, from the surface of the substrate by the peeling liquid, and a removing step of continuing the supply of the peeling liquid forming liquid, after the peeling of the processing film, to wash away and remove the processing film from the surface of the substrate in the state where the removal object is held by the processing film.