Substrate Film Deposition Sequence for 3D Step Coverage
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Solution Overview
Problem
Existing methods face challenges in achieving optimal step coverage of films formed on substrates with complex three-dimensional structures, such as trenches and grooves, during semiconductor manufacturing processes.
Innovation Solution
A method involving a cycle of supplying an inhibitor, a first precursor, a second precursor, and a reactant to the substrate, with each step optimized to enhance film formation on the substrate, including flash supply techniques to improve coverage on recessed areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional film formation methods are used on substrates with three-dimensional structures, then the film formation process is simple, but the step coverage is insufficient
Solution Approach 1:
The film formation process is divided into multiple sequential steps: inhibitor supply step, first precursor supply step, second precursor supply step, and reactant supply step. Each step targets specific regions of the three-dimensional substrate structure, with the inhibitor preferentially adsorbing in recessed areas to guide subsequent precursor deposition, thereby achieving improved step coverage through segmented processing
Solution Approach 2:
The inhibitor is supplied and adsorbed onto the substrate surface before precursor supply. This preliminary action creates a selective adsorption pattern where the inhibitor occupies recessed areas first, preventing precursor adsorption in those regions during subsequent steps. This pre-established pattern enables controlled film formation with enhanced step coverage
2Manufacturing precision
If multiple cycles are performed to improve film coverage, then step coverage improves, but processing time increases
Solution Approach 1:
The four-step sequence (inhibitor supply, first precursor supply, second precursor supply, reactant supply) is designed to be executed continuously in one cycle. Each step flows into the next without interruption, maintaining continuous useful action. The inhibitor remains adsorbed on the substrate throughout the subsequent precursor and reactant supply steps, providing ongoing guidance for film formation. This continuous multi-step process achieves improved step coverage in a single integrated cycle rather than requiring multiple separate cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances film coverage on substrates with three-dimensional structures by preferentially adsorbing precursors in recessed areas, resulting in improved film formation and adherence.
Implementation Method 1
an inhibitor is supplied to a substrate; a first precursor is supplied from a first reservoir to the substrate
Implementation Method 2
a first precursor is supplied from a first reservoir to the substrate; a second precursor is supplied from a second reservoir to the substrate; a reactant is supplied to the substrate
Data Source
AI summary
There is provided a technique that includes forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying an inhibitor to the substrate; (b) supplying a first precursor from a first reservoir to the substrate; (c) supplying a second precursor from a second reservoir to the substrate; and (d) supplying a reactant to the substrate.