Substrate Film Thickness Stabilization Using Fluid Supply
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Solution Overview
Problem
Existing film thickness measurement techniques fail to account for over-time changes in film thickness, particularly in SiARC films, leading to variations and complications in etching processes due to daily differences in inspection timing and film stability.
Innovation Solution
A substrate processing apparatus and method that includes a heat treatment part and a fluid supply part to suppress film thickness variations by supplying fluids like DIW or thinner to the substrate during or after heat-treatment, stabilizing the film thickness before measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If film thickness measurement is performed without fluid supply, then measurement process is simple, but film thickness varies over time leading to measurement inaccuracies
Solution Approach 1:
A fluid supply part is introduced as an intermediary component between the substrate and the measurement environment. This fluid (typically inert gas or liquid) acts as a mediator that stabilizes the film thickness by suppressing evaporation and environmental interactions, thereby enabling accurate measurements without requiring complex environmental control systems.
Solution Approach 2:
The fluid is supplied to the substrate before and during the measurement process in advance. This preliminary action of establishing a stable fluid environment prevents film thickness variations from occurring during measurement, eliminating the need for post-measurement corrections or repeated measurements.
2Stability of the object's composition
If measurement is delayed after heat treatment, then processing time is sufficient, but film thickness becomes unstable
Solution Approach 1:
The fluid supply maintains a continuous stabilizing action on the film surface from heat treatment through measurement. This continuous protection ensures that the film thickness remains stable throughout the entire period, allowing measurements to be performed at any time without concern for stability changes.
3Reliability
If no fluid supply is used, then process is simpler, but daily variations in inspection timing cause etching process complications
Solution Approach 1:
The fluid supply system provides self-service stabilization to the film, automatically maintaining consistent film thickness regardless of when measurement occurs in the daily schedule. This eliminates the need for manual adjustments or special handling procedures to account for timing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively stabilizes film thickness by suppressing variations over time, ensuring accurate measurements and consistent film characteristics for subsequent processes.
Implementation Method 1
a heat treatment part configured to heat-treat a substrate coated with a coating film
Implementation Method 2
a fluid supply part configured to supply a fluid, which suppresses variations in a film thickness over time until the film thickness is measured by the film thickness measurement device, to the substrate during or after the heat-treatment
Data Source
AI summary
A substrate processing apparatus for processing a substrate to be measured by a film thickness measurement device, includes: a heat treatment part configured to heat-treat a substrate coated with a coating film; and a fluid supply part configured to supply a fluid, which suppresses variations in a film thickness over time until the film thickness is measured by the film thickness measurement device, to the substrate during or after the heat-treatment by the heat treatment part.