Substrate Mounting Stage Film Discontinuity for Transfer Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In substrate processing, the formation of continuous films between the substrate and the mounting stage can lead to substrate transfer failures and damage.
Innovation Solution
A technique involving the use of a mounting stage with a first member that generates stress through thermal deformation differences, causing the second film to become discontinuous, thereby preventing substrate damage and transfer failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a continuous film is formed between the substrate and the mounting stage, then film continuity is improved, but substrate transfer reliability deteriorates
Solution Approach 1:
The film is intentionally segmented into continuous and discontinuous regions. The first film is formed continuously on the substrate surface, while the second film on the mounting stage surface is formed discontinuously with gaps. This segmentation allows the film to provide necessary coverage while preventing adhesion issues during transfer.
Solution Approach 2:
Different regions of the mounting stage surface are treated differently. The first member (contact portion) has a surface that forms discontinuous second film, while other portions may have different properties. This local differentiation ensures proper film formation characteristics in specific areas to prevent transfer failures.
2Area of stationary object
If a continuous film is formed between the substrate and the mounting stage, then film coverage is improved, but substrate damage risk increases
Solution Approach 1:
The film structure is segmented such that the second film on the mounting stage is discontinuous with controlled gaps. This provides sufficient coverage for processing while creating separation zones that prevent damage during substrate transfer operations.
Solution Approach 2:
The harmful continuous adhesion is extracted or removed from critical transfer regions. By forming discontinuous second film on the mounting stage surface, the patent removes the continuous bonding that would cause damage during transfer, while maintaining coverage in non-critical areas.
3Stability of the object's composition
If thermal deformation difference is utilized to create stress, then film discontinuity is achieved, but process complexity increases
Solution Approach 1:
The patent utilizes changes in thermal parameters (temperature) to induce differential deformation between the substrate and mounting stage. By controlling temperature during film formation and subsequent cooling, stress is generated that causes the second film to become discontinuous, achieving the desired effect through parameter control rather than mechanical means.
Solution Approach 2:
The patent exploits thermal expansion differences between materials with different thermal coefficients. When the substrate and mounting stage are cooled after high-temperature film formation, their different contraction rates generate stress in the second film, causing it to become discontinuous and preventing transfer failures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses substrate transfer failures and damage by creating a discontinuous second film, ensuring secure handling and processing.
Implementation Method 1
generating stress attributable to a difference in thermal deformation amount between the first member and the substrate
Data Source
AI summary
There is provided a technique that includes: (a) mounting a substrate on a mounting stage in which at least a part of a surface is constituted by a first member; (b) forming films by supplying a first gas, the films including a first film formed on a surface of the substrate and a second film having a portion continuous with the first film and formed on a surface of the first member; and (c) generating stress attributable to a difference in thermal deformation amount between the first member and the substrate, inside the second film, and making at least a part of the second film discontinuous.