Substrate Processing Film Uniformity Control
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Solution Overview
Problem
In semiconductor manufacturing, existing substrate processing systems face challenges in effectively controlling the film-forming amount on substrates, particularly due to variations in substrate arrangement patterns and processing temperatures, leading to non-uniform film thickness and inefficiencies in film formation processes.
Innovation Solution
A substrate processing system that includes a pattern obtaining unit, a calculation unit, a determination unit, and a control unit to estimate and adjust the film-forming amount by analyzing substrate arrangement patterns and processing temperatures, ensuring the film-forming amount is within predetermined ranges and optimizing the heating and gas supplying processes for uniform film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are arranged in different patterns in the substrate processing apparatus, then substrate utilization efficiency is improved, but film-forming amount uniformity deteriorates
Solution Approach 1:
The system performs preliminary calculation of the film-forming amount for each substrate based on the arrangement pattern before actual film formation. This allows prediction of which substrates may have non-uniform film formation, enabling pre-adjustment of processing conditions to compensate for expected variations and achieve uniform film thickness across all substrates.
Solution Approach 2:
The system dynamically adjusts processing parameters (such as heating temperature, gas flow rate, or processing time) based on the calculated film-forming amounts for different substrate positions. By changing these parameters according to the specific arrangement pattern and predicted film formation characteristics, the system maintains film uniformity while accommodating various substrate arrangements.
2Manufacturing precision
If processing conditions are adjusted to achieve uniform film formation, then film-forming amount uniformity is improved, but processing time increases
Solution Approach 1:
Instead of uniformly adjusting processing conditions for all substrates, the system applies localized adjustments based on each substrate's position and predicted film-forming characteristics. Substrates requiring more film formation receive extended processing or enhanced conditions locally, while others proceed with standard parameters, thereby achieving overall uniformity without globally extending processing time.
Solution Approach 2:
The system applies processing conditions selectively to specific substrates based on their individual needs rather than applying uniform extended processing to all. Only substrates predicted to have insufficient film formation receive additional or intensified processing, avoiding unnecessary time consumption for substrates that will achieve adequate coverage with standard parameters.
3Productivity
If the substrate processing apparatus processes multiple substrates simultaneously, then productivity is improved, but control complexity of film-forming amount increases
Solution Approach 1:
The system employs self-service through automated calculation and determination units that independently assess the film-forming amount for each substrate based on its position and the arrangement pattern. This automated self-evaluation eliminates the need for complex manual control and monitoring, allowing the system to manage multiple substrates simultaneously with minimal operator intervention while maintaining precise control.
Solution Approach 2:
The system incorporates feedback mechanisms where the calculated film-forming amounts are used to determine appropriate processing conditions, which are then applied and their effects monitored. This closed-loop feedback enables the system to automatically adjust and optimize processing for multiple substrates, reducing control complexity by allowing the system to self-regulate based on real-time calculations and observed results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise control over film-forming amounts, ensuring uniformity and efficiency in film formation, thereby enhancing the quality and consistency of semiconductor wafers by dynamically adjusting processing conditions based on real-time data and models.
Implementation Method 1
a substrate processing unit which is adapted for storing therein a plurality of substrates including unprocessed substrates and processed substrates respectively arranged in a multistage fashion as well as adapted for providing a heating process and a gas supplying process to the plurality of substrates, so as to form a film on each of the plurality of substrates
Implementation Method 2
adapted for providing a heating process and a gas supplying process to the plurality of substrates, so as to form a film on each of the plurality of substrates
Data Source
AI summary
The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates. The substrate processing system includes a substrate processing unit adapted for forming a film on each of the plurality of substrates; a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of unprocessed substrates and processed substrates among the plurality of substrates; and a memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates. A calculation unit calculates an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on the arrangement/film-forming-amount model. Then, a determination unit determines whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range. If the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range, a control unit will control and drive the substrate processing unit to process the substrates.