High-Frequency Module Substrate Layout to Limit Filter-Inductor Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The attenuation characteristics of filters in high frequency modules can deteriorate due to the arrangement and orientation of inductors on the mounting substrate.
Innovation Solution
A high frequency module design that includes specific arrangements of reception filters, low noise amplifiers, and inductors on a mounting substrate, where the inductors are strategically positioned to minimize electromagnetic interference and maintain optimal filter attenuation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If inductors are arranged at input/output parts of individual filters on the mounting substrate, then impedance adjustment can be performed for the individual filters, but attenuation characteristics of the filters may be deteriorated
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar arrangement to a three-dimensional stacked arrangement. The first inductor is placed on the first main surface of the mounting substrate, while the first reception filter is placed on the second main surface (opposite side) of the mounting substrate. This vertical separation in the thickness direction eliminates overlapping in the planar view, thereby preventing electromagnetic interference while maintaining impedance adjustment capability.
Solution Approach 2:
The patent segments the mounting substrate into two separate surfaces (first main surface and second main surface) for placing different components. By dividing the placement space into opposite sides of the substrate, the inductor and filter are spatially separated, reducing electromagnetic coupling and interference while allowing independent optimization of each component's performance.
2Device complexity
If inductors are placed on the same surface as filters, then device integration is achieved, but electromagnetic interference occurs between inductors and filters
Solution Approach 1:
The patent resolves the electromagnetic interference issue while maintaining integration by utilizing the thickness direction of the mounting substrate. Components are distributed across opposite surfaces (first main surface and second main surface) rather than being crowded on a single surface. This vertical stacking approach achieves three-dimensional integration, reducing planar density and electromagnetic coupling between inductors and filters.
Solution Approach 2:
The mounting substrate itself acts as an intermediary element that physically separates the inductor and filter components by placing them on opposite surfaces. This intermediate structure provides electrical isolation and reduces electromagnetic interference while maintaining controlled impedance paths for signal transmission between the separated components.
Data Source
AI summary
A high frequency module includes a first reception filter, a second reception filter, a first low noise amplifier, a first inductor, a second inductor, and a mounting substrate. The first reception filter, the second reception filter, the first inductor, and the second inductor are disposed on a first main surface of the mounting substrate. When seen in plan view from a thickness direction of the mounting substrate, an outer size of the first inductor is larger than an outer size of the second inductor. The first inductor includes a first part around which part of a wire is closely wound and a second part around which a remaining part of the wire is sparsely wound. In an orthogonal direction that is orthogonal to the thickness direction, the first part of the first inductor and the first reception filter do not overlap.