Substrate Fine Coarse Redistribution Layer Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to develop a circuit board structure that matches the reduced size of semiconductor chips and package structures without increasing manufacturing costs, while also simplifying the manufacturing process and improving production efficiency, especially in applications like electronic devices with multiple components and optical communication systems.
Innovation Solution
A substrate structure with a fine redistribution layer and a coarse redistribution layer, where the fine layer has a denser conductive pattern and is electrically connected to the coarse layer, allowing direct chip mounting and reducing thickness, and embedding optical signals and electrical signals for enhanced information processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of semiconductor chip and package structure is reduced to achieve high density and high efficiency, then the thickness and size of electronic devices are reduced, but it becomes difficult to match the circuit board structure with fine and coarse circuitry density without increasing manufacturing costs
Solution Approach 1:
The circuit board is divided into three distinct portions: a first portion with fine circuitry, a second portion with coarse circuitry, and an intermediate portion connecting them. This segmentation allows each portion to be optimized independently for its specific function while maintaining overall compatibility with reduced-size chips and packages.
Solution Approach 2:
Different regions of the circuit board are assigned different circuitry densities tailored to their specific requirements. The first portion has fine circuitry with higher density to match the chip's fine-pitch connections, while the second portion has coarse circuitry with lower density for standard-package connections, eliminating the need to increase density uniformly across the entire board.
2Adaptability or versatility
If numerous components are included in the package module to meet application requirements, then the functionality is improved, but the overall thickness and size of the electronic device become difficult to reduce
Solution Approach 1:
The patent transitions from a vertical stacking approach to a horizontal planar integration approach. Multiple functional components are arranged side-by-side on the circuit board rather than stacking them vertically, which maintains functionality while reducing the overall thickness of the electronic device.
3Reliability
If conventional manufacturing method is used to separately package each optical fiber for optical communication, then the signal transmission is ensured, but the manufacturing process becomes complicated and production efficiency is reduced
Solution Approach 1:
Multiple optical fibers are bundled together into a single optical cable that connects directly to the circuit board's optical interface. This merging of multiple separate packaging operations into a single integrated connection simplifies the manufacturing process, improves production efficiency, and maintains signal transmission reliability through proper cable shielding and connection design.
Data Source
AI summary
A substrate structure includes a first portion, a second portion, and an intermedia portion disposed between the first and the second portion and the electrically connected business. The first portion includes a first fine redistribution layer (RDL) and a first coarse RDL. The first coarse RDL includes a first coarse conductive pattern, electrically connected to the first fine conductive pattern, where a, the first coarse RDL includes a first coarse conductive pattern Layout density of the first fine conductive pattern is denser than that of the first coarse conductive pattern. The second portion includes at least one of a second fine RDL and a second coarse RDL. An electronic device including a substrate structure is also provided.