Substrate Fixing Device Wiring Heat Uniformity
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Solution Overview
Problem
Conventional substrate fixing devices face issues with heat uniformity due to the high resistivity of heating elements, which can lead to unintended heat generation in wiring lines, impairing the uniformity of heat distribution.
Innovation Solution
A substrate fixing device is designed with an insulating layer between the baseplate and the electrostatic chuck, featuring a heating element made of a rolled alloy with a lower resistivity and wiring lines composed of a high resistance part and a low resistance part, where the low resistance part is formed of a material with a lower resistivity than the heating element, reducing heat generation and maintaining heat uniformity across zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating element with high resistivity is used, then the heating element can generate sufficient heat, but the wiring lines generate unintended heat which impairs heat uniformity
Solution Approach 1:
The wiring line is segmented into two distinct parts: a first conductive layer made of the same material as the heating element, and a second conductive layer made of a material with lower resistivity. This segmentation allows the wiring line to have different electrical properties in different sections, reducing overall resistance and unintended heat generation while maintaining the heating element's heat generation capability
Solution Approach 2:
The wiring line is constructed as a composite structure combining two different conductive materials. The first conductive layer uses the same material as the heating element (higher resistivity), while the second conductive layer uses a material with lower resistivity. This composite structure optimizes both heat generation at the heating element and heat uniformity by reducing resistive heating in the wiring lines
2Power
If wiring lines are provided to extend from the heating element to power feed terminals, then power can be supplied to the heating element, but the wiring lines formed of the same material as the heating element generate unintended heat
Solution Approach 1:
The electrical parameter (resistivity) of the wiring line is changed by using a second material with lower resistivity for the second conductive layer. This parameter change reduces the wiring line's resistance, thereby reducing unintended heat generation (I²R losses) while maintaining adequate power supply capability to the heating element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces heat generation in wiring lines and improves heat uniformity, allowing for finer patterns and more efficient temperature control in the substrate fixing device.
Implementation Method 1
The heating element, for example, is joined to a surface of the electrostatic chuck using an adhesive, and generates heats when supplied with voltage from a power supply disposed outside the substrate fixing device through power feed terminals
Implementation Method 2
an insulating layer interposed between the baseplate and the electrostatic chuck
Data Source
AI summary
A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.