Substrate Fixing Apparatus Warpage Correction Mechanism
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Solution Overview
Problem
Existing substrate fixing techniques fail to accurately correct warpage in the outer peripheral parts of film-like substrates, leading to incorrect recognition of fiducial marks and improper mounting or inspection of components, particularly in substrate working apparatuses with conveying members.
Innovation Solution
A substrate fixing apparatus and method that uses a back-up member and substrate pressing members to support and correct warpage in the outer peripheral parts of substrates, with the back-up member providing suction to fix the substrate and the pressing members pressing down on the substrate's surface to correct warpage, while the substrate is conveyed by a pair of conveying members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pressing member is used to correct warpage only at the component mounting part, then the warpage at the mounting area is reduced, but the outer peripheral part of the substrate becomes warped and suction force is reduced
Solution Approach 1:
The pressing member is designed to apply localized pressure specifically to the outer peripheral part of the substrate where warpage occurs during conveyance. By concentrating the pressing action at the critical peripheral regions rather than uniformly across the entire substrate, the invention corrects warpage at the source without interfering with the suction grooves at the component mounting area, thus maintaining both manufacturing precision and suction reliability
Solution Approach 2:
The pressing member activates before the substrate reaches the component mounting position to pre-correct warpage in the outer peripheral areas. This preliminary correction ensures that when the substrate arrives at the mounting area, the warpage has already been addressed, preventing subsequent suction force reduction and ensuring accurate component placement
2Ease of operation
If the substrate is suctioned only at the component mounting part, then components can be mounted, but fiducial marks on the peripheral part cannot be accurately recognized
Solution Approach 1:
The suction system is designed with suction grooves concentrated at the component mounting area, while the pressing member independently handles the outer peripheral regions. This localized functional division allows suction to effectively hold the substrate at the mounting area for easy component operation, while the pressing member simultaneously ensures flatness at the peripheral areas where fiducial marks are located, enabling accurate mark recognition
Solution Approach 2:
The pressing member acts as an intermediary mechanism that bridges the gap between the suction system and fiducial mark recognition. By pressing the outer peripheral part flat, it creates optimal conditions for fiducial mark detection without interfering with the suction-held component mounting area, thus mediating between the two functional requirements
3Productivity
If conveying members support the substrate from below at a distance, then substrate conveyance is enabled, but warpage in the outer peripheral part increases
Solution Approach 1:
The pressing member serves as an intermediary that compensates for the warpage induced by the conveying members. While the conveying members maintain their elevated position for efficient substrate transport, the pressing member actively presses the outer peripheral part flat at the working position, neutralizing the warpage effect and enabling both efficient conveyance and accurate processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively corrects warpage in the outer peripheral parts of substrates, ensuring accurate recognition of fiducial marks and proper positioning for component mounting and inspection, even when fiducial marks are outside the suction area, and stabilizes the substrate for reliable fixing and operation.
Implementation Method 1
a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view from above and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members
Data Source
AI summary
A substrate fixing apparatus includes a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members. An elevation driver moves at least one of a back-up member and a substrate pressing member upward and downward. The elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate.