Substrate Processing Flow Control for Uniform Gas Bubble Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In substrate processing, increased upward flow rates in process tanks can lead to uneven processing due to gas bubbles flowing towards the central part, causing processing unevenness on the substrate surface.
Innovation Solution
A substrate processing device with outer and inner gas bubble generation pipes and controlled gas and liquid flow rates to uniformly distribute gas bubbles across the substrate surface, using a controller to adjust flow rates based on liquid flow rates to maintain uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the upward flow rate is increased to improve liquid displacement, then liquid circulation is enhanced, but gas bubbles deviate toward the central part causing processing unevenness
Solution Approach 1:
The patent applies local quality by differentiating gas supply between outer and inner regions. The outer gas bubble generation pipes receive higher gas flow rates than inner pipes, creating localized gas bubble distribution that counteracts the central deviation caused by upward flow, thereby maintaining uniform processing across the substrate surface
Solution Approach 2:
The patent changes the parameter of gas flow rate distribution by controlling outer gas supply to be larger than inner gas supply. This parameter adjustment compensates for the flow-induced bubble deviation, allowing the system to maintain processing uniformity even at higher upward flow rates
2Manufacturing precision
If gas flow rate to outer pipes is increased to prevent processing unevenness, then outer region processing is improved, but system complexity increases
Solution Approach 1:
The patent segments the gas supply system into outer and inner regions with separate control. By dividing the substrate processing area into peripheral and central zones with dedicated gas bubble generation pipes for each, the system achieves differential gas distribution without requiring complex individual control for each pipe
Solution Approach 2:
The controller performs multiple functions by simultaneously managing liquid discharge flow rates and gas supply flow rates. This multi-functionality allows coordinated control of both liquid circulation and gas bubble generation, achieving processing uniformity through integrated control rather than separate complex systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses processing unevenness on the substrate surface even with increased upward flow rates, improving yield and ensuring uniform gas bubble distribution.
Implementation Method 1
an outer gas bubble generation pipe that generates gas bubbles in the processing liquid by supplying gas in the processing liquid; an inner gas bubble generation pipe that generates gas bubbles in the processing liquid by supplying gas in the processing liquid
Implementation Method 2
a plurality of liquid discharge pipes that, by discharging the processing liquid into the process tank, generate an upward flow which moves upward inside the process tank
Data Source
AI summary
Processing unevenness within a substrate surface is further suppressed even in a case where an upward flow rate increases. A substrate processing device includes a controller that controls, on the basis of a flow rate of a processing liquid which is controlled by a second flow rate control mechanism, a first flow rate control mechanism so that a flow rate of gas supplied to a first gas supply pipe is larger than a flow rate of gas supplied to a second gas supply pipe.